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About This Role
- This position is a packaging back-end R&D intern, and will be focusing on IC (integrated circuit) packaging technology research and development, work with global team to finish development projects and other tasks as listed below: New packaging technology development New package related process development Advanced material interface study Advanced IC package failure analysis Coordinate/lead development project independently Communication/cooperation among global teams (US/ Europe /Malaysia/Japan/France/etc.) Qualification: Pursuing in master degree Major on: Metallic Materials Engineering; Polymer Materials Engineering; Mechanical Engineering and Automation.
- At least CET-4 degree or equivalent English level and CET-6 is preferred.
- Intention and capability to work in a cross-functional/global team environment.
- Independent R&D capability.
- More information about NXP in Greater China... #LI-65f0
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Specialisation
Open roles at NXP Semiconductors
607 positions
Job ID
/job/Tianjin-Xinghua/XMLNAME-2025-Intern---Packaging-Engineer_R-10059388
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