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About This Role
- As a world's leading chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art.
- From semiconductor process development and manufacturing, through yield improvement to final test and optimization, and lastly advanced die prep and packaging.
- Employees in Intel Foundry are part of a worldwide network of manufacturing, advanced packaging, and assembly/test facilities.
- As a Quality and Reliability Engineer (QRE), you will be part of FQRL (Foundry Quality, Reliability, and Labs), Intel's Quality and Reliability organization.
- We are strong believers in partnership, collaboration and teamwork.
- You will routinely work with the fab module engineers, process integration[RB1.1] and worldwide employees both internal and external to Intel.
- This is an on-site role that requires living in Oregon.
- This role requires evening meetings most work days.
- The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly.
- In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing.
- C4 (bumping) QREs cover several critical process segments[RB2.1] such as interposer, micro-logical, and package side bumping in the WPM organization.
- Your key deliverables will include: • Manage customer quality (both internal and external) issues on products. • Extract and Analyze data to support risk assessment of suspect/non-conforming material. • Support and engage with down-stream partners to manage excursions, down-stream investigations, and respond to issues. • Partnering with other organizations to proactively drive improvements in quality and reliability performance. • Ensure that the metrics and goals for the end-of-line-hold operations are met, as well as MRB (Material Review Board) [RB3.1]inventory. • Identify and drive activities and projects to improve detection and containment of potentially discrepant or unreliable material. • Support Certification and Ramp of new technologies from on-site and off-site development teams. • 24x7 on-call response (as part of an engineering rotation) to respond to urgent line issues, excursions, or to support task force-level projects.
- The ideal candidate should exhibit the following behavioral traits: • Strong communication and collaboration skills with the ability to work effectively across cross-functional teams. • Experience in manufacturing environments or familiarity with high-volume production processes. • A growth mindset and active interest in continuous learning and development. • Make technical decisions and provide technical direction. • Evidence of organizational and planning skills for engineering projects. • Demonstrate effective communication up and down the organization, including skills to communicate technical issues and status to factory and program leadership. • Effectively work in a highly networked, cross organization role. • Exhibit strong team building and influencing skills. • Work under pressure, and in an ever-changing and dynamic environment Qualifications: You must possess the below minimum qualifications to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Requirements
- Master's degree in a specialized field such as Engineering, Science, or a related discipline At least 6 months of experience in the following: - Knowledge of manufacturing processes, semiconductor fabrication, and quality assessment methodologies. - Familiar with excursion management, reliability fundamentals, or problem-solving techniques. - Proficiency in statistical analysis techniques and tools, such as JMP or Minitab.
Nice to Have
- Master's degree in Engineering or Science, with semiconductor foundry experience. -Ability to write automation scripts to improve efficiency of data extraction and analysis. - Proven ability to collaborate across cross-functional teams and represent quality functions in engineering forums. - Strong communication and leadership skills, with a proactive approach to driving process optimization. - Demonstrated ability to manage change control processes and drive continuous improvement programs - Familiarity with product and process reliability principles and methods. - Knowledge of quality control systems and methodologies.
- Join Intel and contribute to shaping the future of semiconductor manufacturing through innovation, excellence, and collaboration.
- Apply today to be part of a team that values your expertise and empowers your career growth.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $89,010.00-125,660.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
627 positions
Job ID
/job/US-Oregon-Hillsboro/WPM-C4-Quality-and-Reliability-Engineer_JR0286323-1
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