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About This Role
- Define packaging solutions for highly innovative integrated circuits, meeting adequate mechanical, thermal and electrical performance with the goal to achieve lowest package and system level cost.
- Co-design with chip designer, system engineering and PCB design teams during the development stage to optimize pad layout and pin map for most cost effective package and system.
- Independently plan, design and develop quality custom lead frame/substrate/module with supporting electrical simulation to reduce cross-talk, IR drop, and noise issues of the device.
- Technical lead for implementing packaging solutions at OSAT assembly site and/or internal assembly site.
- Ensure optimized package design which meets the assembly design rules of the selected assembly site.
- Work with the assembly partner to mitigate any potential risk and improve situation to meet yield target within the project milestone requirement.
- Co-work with NPI manager to prepare assembly site readiness for continuous uninterrupted flow from wafer fab-out to quality packaged sample meeting the required NPI schedule.
- Maintain complete set of product specific packaging related drawings, and reports.
Qualifications
- Bachelor / Master degree in Electrical Engineering / Mechanical Engineering / Material Science with more than 10 years experience in the field of IC Packaging Design and Layout.
- Package design experience using Siemens Xpedition EDA tool set is a must.
- Understand performance and cost trade-offs for different layout and assembly rules.
- Extensive manufacturing process knowledge regarding wafer bumping, substrate and lead frame manufacturing and assembly of wire bond and flip chip packages is required.
- Practical knowledge of Signal integrity and Power integrity in PCB design will be an advantage.
- Possesses good analytical, communication and organization skills.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
806 positions
Job ID
/job/India-Bangalore/Silicon-Packaging-Design-Engineer_JR0288608
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