Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)
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Overview
- To provide the best candidate experience amidst our high application volumes, each candidate is limited to 10 applications across all open jobs within a 6-month period.
- Advancing the World’s Technology Together
- Our technology solutions power the tools you use every day--including smartphones, electric vehicles, hyperscale data centers, IoT devices, and so much more.
- Here, you’ll have an opportunity to be part of a global leader whose innovative designs are pushing the boundaries of what’s possible and powering the future.
- We believe innovation and growth are driven by an inclusive culture and a diverse workforce.
- We’re dedicated to empowering people to be their true selves.
- Together, we’re building a better tomorrow for our employees, customers, partners, and communities.
- What You’ll Learn
- Project Overview: Every new generation of AI accelerator pushes more power through stacked memory, and temperature is now one of the limits on how fast and how dense HBM can be.
- Our lab builds compact thermal models that turn workload-driven power maps of a 3D-stacked HBM into transient temperature maps in minutes rather than the hours a full CFD run takes, while staying close to CFD accuracy.
- As an intern you will own one piece of this platform end to end: from the physics and the CFD reference to a validated model that architecture, power, and package teams use to make design decisions.
- Skills You’ll Learn:
- Heat conduction in 3D-stacked die: TSV arrays, micro-bumps, underfill, and anisotropic effective properties
- Compact and reduced-order thermal modeling
- CFD modeling and validation with Simcenter Flotherm
- Scientific computing at scale: sparse solvers, preconditioning, and fast Python/MATLAB code
- Power-thermal co-simulation and thermal-aware design of AI memory systems
- Samsung’s Power & Thermal Lab is seeking a thermal engineering intern to help build and calibrate models of HBM stacks and package.
- We are a small, fast‑moving team where direct ownership and minimal busywork empower every member to tackle the same real‑world problems.
- Working with authentic data, real partners, and production‑grade results, our contributions flow straight into platforms used across the company.
- As an intern, the models you build feed design discussions for future HBM products.
- You will work on real projects with tangible results, receive mentorship, and help shape the scope of work in a collaborative environment where hardware, software, and thermal experts work side‑by‑side on next‑generation AI memory technologies.
- Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy
- Reports to: SVP, R&D (Power & Thermal Lab)
- Build and calibrate CFD models (Simcenter Flotherm) of HBM stacks and packages under realistic cooling conditions, and use them as the reference for fast models.
- Extend our compact thermal model to new stack heights, die configurations, and base-die power, and quantify its accuracy against CFD in both steady state and transient.
- Develop homogenization methods that replace fine features (TSV arrays, micro-bump layers, underfill) with effective properties, and establish where they hold and where they break.
- Speed up thermal solvers by orders of magnitude through model-order reduction, sparse linear algebra and preconditioning, GPU acceleration, or machine-learning surrogates.
- Run transient simulations driven by real AI workload traces, locate spatiotemporal hotspots, and explore thermal-aware policies such as throttling, refresh control, and power-map scheduling.
- Evaluate advanced cooling and thermal-interface options (cold plates, two-phase cooling, TIMs, backside cooling) and translate them into boundary conditions and design guidance for HBM.
- Couple the thermal model with the lab's trace-driven power simulation engine so that power maps and temperature maps evolve together in time.
- Document methods and results clearly and present them to engineers and lab leadership.
What You'll Do
- Pursuing a PhD (preferred) or Master's degree in Mechanical Engineering, Materials Science, Electrical Engineering, Applied Physics, or a related field.
- Must have at least 1 academic quarter/semester remaining
- Strong foundation in heat transfer, especially transient conduction in multi-layer solids and thermal contact resistance.
- Hands-on experience with numerical methods (finite-volume, finite-element, or finite-difference) and scientific programming in Python and/or MATLAB.
- Ability to judge simulation results critically (mesh convergence, boundary conditions, energy balance) and to explain discrepancies between models.
- Experience with Simcenter Flotherm, Ansys Icepak/Fluent, or COMSOL, preferred
- Experience with compact or reduced-order thermal models, model-order reduction, or ML surrogates for physical simulation, preferred
- Background in electronics packaging, 3D-IC / chiplet thermal management, or advanced cooling, preferred
- Familiarity with HPC, sparse linear solvers, or GPU programming, preferred
- You’re inclusive, adapting your style to the situation and diverse global norms of our people.
- An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
- You’re collaborative, building relationships, humbly offering support and openly welcoming approaches.
- Innovative and creative, you proactively explore new ideas and adapt quickly to change.
- The pay range below is for all roles at this level across all US locations and functions.
- Pay within this range varies by work location and may also depend on job-related knowledge, skills, and experience.
Benefits
- centered around the wellbeing of our employees and their loved ones.
- In addition to the usual Medical/Dental/Vision, our inclusive rewards plan empowers our people to care for their whole selves.
- An investment in your future is an investment in ours.
- Relocation Support Live 50+ miles away from your new office? No worries! We'll provide a stipend to help support your move.
- Housing Stipend Signing a lease on a new place for your summer internship? We'll help you pay your way with a monthly stipend.
- Give Back With a charitable giving match and frequent opportunities to get involved, we take an active role in supporting the community.
- Prioritize Emotional Wellness With on-demand apps and paid therapy sessions, you’ll have support no matter where you are.
- Stay Fit Eating well and being active are important parts of a healthy life.
- Our onsite Café and gym, plus virtual classes, make it easier.
Benefits
- are best when you have the space to use them.
- That’s why we facilitate a flexible environment so you can find the right balance for you.
- Hourly Base Pay Rate
- $28—$68 USD
Sourced directly from Samsung Semiconductor’s career page
Your application goes straight to Samsung Semiconductor.
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