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About This Role
- Intel Foundry is seeking experienced Thin Films Metals Module Development Engineers to join the Technology Development organization.
- The role will be defined by developing and delivering metals modules for advanced semiconductor technologies, leveraging a combination of in-depth hardware knowledge and process expertise to deliver modules that fulfill program process needs within the hardware capabilities.
- This is a hands-on technical role for results-oriented engineers who can formulate concise technical problem statements, establish a roadmap and timeline, lead with data and partner with stakeholders to deliver on-time results.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Bachelor's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 6+ years of experience OR Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 4+ years of experience OR Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related STEM fields with 2+ years of experience Experience in semiconductor manufacturing or process development includes one or more of the following: Expertise in process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes Proficiency in Design of Experiments (DOE), Statistical Process Control (SPC), and structured problem-solving methodologies Hands-on expertise in dry etch processes, material science, and equipment metrology Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials Preferred Qualifications: Doctoral degree in a relevant engineering or science field Experience with sub-10nm technology nodes and advanced device architectures like FinFET or Gate-All-Around (GAA) Proven record of delivering process solutions in Technology Development (TD) and High Volume Manufacturing (HVM) Cross-functional leadership experience for yield improvement, defect reduction, or technology ramp initiatives Experience mentoring engineers and providing technical guidance Strong ownership mindset with the ability to lead initiatives from concept through implementation For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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806 positions
Job ID
/job/US-Oregon-Hillsboro/Thin-Films-Module-Development-Engineer_JR0288039
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