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About This Role
- The Role and Impact The Thermal Engineer will drive thermal design and analysis for GPU, AI accelerators, and data center products through both simulation and hands-on experimental work.
- This role supports the development of high-performance computing solutions by ensuring thermal requirements are met across silicon, package, and platform levels.
- The engineer will contribute to thermal performance optimization, laboratory testing, and the development of innovative thermal characterization methodologies for next-generation computing products.
- Key Responsibilities Thermal Design and Analysis Support the development of packaging thermal solutions for GPU and AI products.
- Develop thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules.
- Perform thermal, electrical, and mechanical co-design optimization activities.
- Conduct thermal simulations and analyses to support product development and performance objectives.
- Laboratory and Experimental Work Design and execute experiments to characterize thermal performance from advanced package to system-level cooling solutions.
- Develop innovative thermal metrology techniques for next-generation thermal management solutions, including two-phase cooling systems and microchannel heat spreaders.
- Correlate experimental data with simulation results to improve predictive modeling accuracy.
- Support the development and validation of thermal characterization methodologies and test plans.
- Cross-Functional Collaboration Partner with silicon design, packaging, platform, and system engineering teams to ensure thermal compliance and performance targets are achieved.
- Collaborate across engineering disciplines to optimize thermal solutions for advanced computing products.
- Engage with external customers and ecosystem partners to align thermal solutions with product requirements and industry needs.
- Communicate technical findings and recommendations to stakeholders across multiple organizations.
- Behavioral Skills Strong analytical and problem-solving skills with the ability to evaluate complex technical challenges and develop effective solutions.
- Ability to work effectively in cross-functional and multidisciplinary teams.
- Strong verbal and written communication skills, with the ability to clearly communicate technical concepts to both technical and non-technical audiences.
- Ability to translate simulation results, experimental findings, and technical analyses into actionable design recommendations.
- Demonstrated ability to manage multiple priorities and work effectively in a fast-paced environment.
- Strong attention to detail and commitment to technical excellence.
- Self-motivated with the ability to work independently while contributing to team objectives.
- Demonstrated collaboration and stakeholder management skills when working with internal and external partners.
Requirements
- PhD in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Chemical Engineering, or a related technical field; OR a Master's degree in one of these disciplines with 2+ years of experience in thermal engineering, thermal sciences, or a related field. 2+ years of experience using thermal simulation tools such as Computational Fluid Dynamics (CFD) and/or Finite Element Analysis (FEA) OR 2+ years of experience performing thermal characterization, validation, and experimental testing in a laboratory environment OR 2+ years of experience applying heat transfer principles to thermal management solutions for electronic, semiconductor, data center, or high-performance computing products.
- Preferred Qualifications 2+ years of experience supporting semiconductor, GPU, AI accelerator, server, or high-performance computing products.
- Experience with advanced cooling technologies such as immersion cooling, two-phase cooling, microchannel cooling, or liquid cooling solutions.
- Experience developing thermal metrology and measurement techniques.
- Experience with thermal instrumentation and data acquisition systems, including thermocouples, infrared cameras, flow meters, and related equipment.
- Experience correlating simulation results with experimental data.
- Experience with prototype development and rapid testing methodologies.
- Familiarity with statistical analysis and experimental data processing.
- Understanding of power electronics and energy efficiency concepts.
- Experience translating experimental results into thermal design recommendations.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
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Job ID
/job/US-Arizona-Phoenix/Thermal-data-Analysis-Engineer_JR0284391
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