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About This Role
- Intel Foundry is seeking a highly experienced IC Packaging Design Manager to lead the delivery of advanced packaging solutions within the Advanced Design and Customer Engineering (ADCE) organization.
- You will lead a team responsible for driving package design execution to ensure first-pass success across customer programs.
- In this role, you will act as a trusted technical partner to customers, enabling successful adoption of Intel's advanced packaging technologies (EMIB, Foveros, chiplet architectures).
- This position requires technical depth, and leadership across all aspects of advanced packaging design.
- Key Responsibilities: Leadership and Management Lead and manage a group of IC Packaging Engineers, providing guidance, mentorship, and support to ensure the successful execution of projects.
- Oversee the planning, scheduling, and execution of package design projects, ensuring that milestones and deadlines are met.
- Foster a collaborative and innovative team environment, encouraging continuous learning and professional development.
- Lead design groups, coordinating efforts across multiple teams to achieve project goals.
- Technical Expertise Serve as the primary package design technical lead and guide customers through end-to-end package design flow Drive the development of advanced packaging designs, ensuring compliance with industry standards and best practices.
- Collaborate with cross-functional teams, including package architects, silicon and board design teams, design rule owners, electrical analysis engineers, and integration teams to define and implement design specifications.
- Leverage extensive experience in advanced packaging designs to meet design KPIs.
- Ensure products are designed and developed with high quality standards by overseeing design processes, risk management, and compliance throughout the product design lifecycle, working closely with cross-functional teams to identify and address potential quality issues before they arise.
- Project Management Develop and maintain detailed project plans, including resource allocation, risk management, and progress tracking.
- Coordinate with stakeholders to ensure alignment on project goals, deliverables, and timelines.
- Conduct regular project reviews and provide status updates to senior management.
- Innovation and Improvement Identify and implement process improvements to enhance the efficiency and quality of package designs and development.
- Stay current with industry trends and emerging technologies, incorporating new methodologies and tools into the design process.
- Drive innovation in product design, exploring new approaches and techniques to achieve competitive advantages.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Bachelor's degree in Electrical Engineering or STEM related field with 9+ years of relevant experience OR - Master's degree in Electrical Engineering or STEM related field with 6+ years of relevant experience OR - PhD in Electrical Engineering or STEM related field with 4+ years of relevant experience Relevant experience should include the following: Experience in IC Package, chiplet/SOC design, or heterogenous integration, with at least 3 years in a leadership role.
- Proven experience in a leadership or management role, with a track record of successfully leading engineering teams and delivering complex projects within established timelines.
- Experience in performance/manufacturability/yield aware design methodologies Experience with design flows and methodologies (physical design, analysis, verification).
- Experience working with IC Packaging EDA tools from Siemens and/or Cadence.
- Experience with packaging technologies and heterogenous integration Preferred Qualifications Experience with IC Packaging designs for HPC/AI class of products Join Intel and contribute to shaping the future of technology.
- Be a part of a dynamic team committed to delivering innovative solutions that address the needs of a rapidly evolving world.
- Apply today to take the next step in your career.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
674 positions
Job ID
/job/US-Arizona-Phoenix/Silicon-Packaging-Engineering-Manager_JR0284826
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