Senior Testchip SoC Physical Design Engineer (Integration & Methodology)

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About This Role

  • About the Role Join the Design Technology Platform (DTP) organization within Intel Foundry as part of the X-Chip SoC Full-Chip Integration team.
  • This team plays a critical role in enabling next-generation semiconductor innovation by delivering testchip platforms that validate advanced process technologies and support high-volume manufacturing readiness.
  • In this role, you will contribute to the development of physical design methodologies and drive full-chip SoC integration for cutting-edge testchip vehicles.
  • You will collaborate across design, process, and manufacturing teams to ensure high-quality, scalable solutions for advanced technology nodes.
  • What You’ll Do Key responsibilities will include but not limited to: Developing layout design methodology for testchip development in next generation process nodes Working closely with Process Integration, Yield and QnR to define critical Design features that need to be exercised in the early lead vehicle test chips.
  • Establishing, orchestrating, overseeing, and maintaining hierarchical layout design specifications for correct-by-construction integration Building and executing tactical plans to converge hierarchical SOC layout design against aggressive schedule requirements by working closely with PDK teams Driving all aspects of physical design convergence, including preparing layout hierarchy for design tape-in, debugging and resolving issues uncovered by verification tools Working with tool/flow owners and vendors for ongoing tool/methodology improvement Behavioral traits that we are looking for: Exhibiting strong interest in Layout design in advanced technology nodes.
  • Strong verbal and written communication skills Ability to work well both autonomously and in an intensive, cooperative team environment Coordinate between different stakeholders for testchip to arrive at execution commit for testchip Motivation to continuously learn and drive to push improved layout productivity and efficiency Why Join Us Work on cutting-edge semiconductor technologies that shape the future of computing Collaborate with industry-leading experts across design and manufacturing Opportunities for career growth and technical leadership Contribute to innovations that impact global technology at scale Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life See Intel Benefits for more details.

Requirements

  • are required to be initially considered for this position.
  • Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
  • Immigration Sponsorship Information Minimum Qualifications and Experience : Master's degree in electrical engineering or related field with minimum of 5 years of experience in the following areas: Experience with physical/layout design in advance technology nodes In Layout design tools like Cadence Virtuoso Suite or Synopsys Custom Compiler Design rules and layout constraints in advanced semiconductor processes Experience with floorplanning, hierarchical design integration, and layout verification/debug Preferred Qualifications and Experience : Experience in Definition of Testchip/Product design from Concept to Execution Commit Experience in working with Foundry teams on negotiating features to exercise in design Proven Project Management skills on coordinating and tracking the entire design cycle of a project from Feature definition to final Tape-in Previous related work experience in a semiconductor foundry preferred Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, California, Santa Clara, US, Texas, Austin Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
  • We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
  • Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel .
  • Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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/job/US-Oregon-Hillsboro/Senior-Testchip-SoC-Physical-Design-Engineer--Integration---Methodology-_JR0283848

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