Opens intel.wd1.myworkdayjobs.com in a new tab
About This Role
- The Role and Impact As a Process and Equipment Engineer specializing in Wafer Laser and Saw Singulation Technologies, you will serve as the technical owner responsible for driving the performance, capability, and stability of advanced wafer singulation processes within our high-volume semiconductor manufacturing environment.
- In this role, you will leverage your expertise in precision laser-material interaction, wafer dicing, laser ablation, and singulation technologies to solve complex process and equipment challenges, optimize manufacturing performance, and implement innovative solutions that enable next-generation semiconductor products.
- Your hands-on contributions will directly impact factory yield, quality, equipment uptime, Manufacturing Availability (MA), cost competitiveness, and process robustness.
- You will play a critical role in supporting Intel's advanced packaging, NPI and wafer manufacturing roadmap through the deployment of cutting-edge laser and sawing technologies.
What You'll Do
- Process Optimization - Own and optimize laser ablation and wafer saw process parameters to achieve best-in-class yield, quality, and throughput.
- Yield Improvement - Drive systematic defect reduction initiatives targeting burrs, chipping, cracking, kerf quality, and recast.
- Equipment Engineering - Lead complex troubleshooting and reliability improvements for laser ablation, laser dicing, and wafer saw equipment.
- Maintenance Strategy - Develop and execute preventive and corrective maintenance plans to maximize equipment uptime and MA.
- Data Analytics - Utilize SPC, DOE, FMEA,JMP and advanced analytics to identify root causes of process variation and equipment failures.
- Automation and AI Solutions - Develop and deploy Python/Co-pilot/Github/ Gemini- and AI-based solutions for defect monitoring, predictive maintenance, and process optimization.
- Technology Development - Collaborate with TD teams to evaluate, develop, and qualify next-generation laser processing and singulation technologies.
- New Product Introduction (NPI) - Support process qualification, technology transfer, and high-volume manufacturing ramp for new products.
- Cross-Functional Collaboration - Partner with upstream and downstream process owners to improve end-to-end manufacturing performance.
- Supplier Engagement - Work closely with equipment vendors to implement hardware upgrades, software enhancements, and productivity improvements.
- Documentation and Standards - Develop and standardize SOPs, troubleshooting guides, BKMs, and engineering documentation.
- Technical Leadership - Present technical findings, project updates, and business impact assessments to factory stakeholders and leadership teams.
- Manufacturing Excellence - Drive continuous improvement initiatives focused on yield, quality, cost reduction, and cycle-time optimization.
- Safety and Compliance - Ensure compliance with Intel safety, quality, and environmental requirements while promoting a strong safety culture.
Requirements
- Bachelor's or Master's Degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Mechatronics Engineering, Materials Engineering, Physics, or a related engineering discipline. • Fresh graduates with strong technical aptitude, problem-solving skills, and a passion for semiconductor manufacturing are encouraged to apply. • 0-1 year experience in relevant industry.
Nice to Have
- More than 2 years in relevant industry. • Experience in semiconductor manufacturing, particularly in wafer singulation, laser ablation, laser dicing, stealth dicing, wafer saw, Die Preparation, or advanced packaging processes, will be an added advantage. • Strong understanding of laser-material interaction, optics, motion control systems, vision alignment systems, and precision manufacturing technologies is highly desirable. • Knowledge of Statistical Process Control (SPC), statistical data analysis, and structured problem-solving methodologies; experience with Design of Experiments (DOE), Failure Mode and Effects Analysis (FMEA), and Root Cause Analysis (RCA) will be an added advantage. • Experience with data analytics, automation, and programming tools such as Python, JMP, SQL, Power BI, or AI-based manufacturing applications will be an added advantage. • Demonstrated ability to troubleshoot technical challenges using a structured and data-driven approach. • Strong analytical and problem-solving skills with the ability to work independently and in a team-based environment. • Excellent communication and interpersonal skills with the ability to collaborate effectively across cross-functional teams. • Self-motivated, results-oriented, and passionate about continuous improvement, innovation, and cost reduction. • Willingness to work in a cleanroom manufacturing environment and support factory operations as required.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
Opens intel.wd1.myworkdayjobs.com in a new tab
Specialisation
Open roles at Intel
806 positions
Job ID
/job/Malaysia-Kulim/Process-and-Equipment-Engineer_JR0288678
Get matched to roles like this
Upload your resume once. We’ll notify you when matching roles open up.
Join talent pool — freeSimilar Other roles
Samsung Semiconductor
Staff Engineer, SRAM Circuit Design
San Jose, California, United States|Other
Samsung Semiconductor
Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)
San Jose, California, United States|Other
Samsung Semiconductor
Intern, Systems Software Engineering
San Jose, California, United States|Other
Samsung Semiconductor
Intern, SRAM Design Engineer
San Jose, California, United States|Other