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About This Role
- The Role and Impact As a Packaging Module Development Engineer within Intel's Assembly Technology Development (ATD) team, you will be at the forefront of innovation, driving the advancement of cutting-edge semiconductor packaging technologies that power the future of computing.
- Your work will enable Intel's leadership across mobile, edge, and hyperscale computing platforms by developing and optimizing industry-leading package assembly solutions.
- This dynamic role offers the unique opportunity to collaborate with cross-disciplinary teams, innovate across materials, equipment, and processes, and scale advanced packaging platforms for high-volume manufacturing.
- Your contributions will directly impact quality, reliability, and manufacturability, ensuring Intel's roadmap stays ahead of the curve in delivering transformative technologies.
- Key Responsibilities - Develop First Level, Second Level, and Mid-Level Interconnect (FLI, SLI, MLI), as well as thermal and surface mount technology (SMT)/printed circuit board (PCB) metrology solutions, to support Intel's advanced packaging platforms. - Collaborate with multifunctional teams to optimize assembly processes, focusing on quality, reliability, cost, yield, productivity, and manufacturability. - Innovate next-generation materials, equipment, and fabrication techniques to advance semiconductor packaging capabilities. - Conduct process development and equipment characterization through statistical techniques such as Statistical Process Control (SPC) and Design of Experiments (DOE). - Manage dynamic technical projects to meet critical product development timelines. - Provide sustaining support for equipment performance and process health in high-volume manufacturing environments. - Partner with suppliers and cross-organizational teams to ensure material specifications and quality requirements are met. - Lead efforts in identifying and addressing potential package quality and reliability challenges through innovative techniques and tools.
- The ideal candidate demonstrates: - Proven track record of technical leadership, strategic planning, and critical thinking in challenging environments. - Ability to manage shifting priorities while driving impactful results. - Strong communication, influencing, and analytical skills to collaborate across diverse teams.
Requirements
- Bachelor's or BS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 4+ years of relevant experience -OR- Master's or MS degree in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 3+ years of relevant experience - OR- PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or related STEM field with 1+ years of relevant experience Relevant Experience should include the following: - Demonstrated expertise in metrology solutions for semiconductor and assembly technologies - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE).
- Preferred Qualifications - Demonstrated expertise in packaging fundamentals, quality and reliability standards, and redistribution layers (RDL) packaging. - Experience in technology development, including delivering results for complex and time-critical technical projects. - Familiarity with semiconductor fabrication processes, assembly technologies, and materials. - Previous related work experience in a semiconductor foundry preferred Join Intel and be a part of a team that redefines the future of semiconductor packaging.
- Your expertise will shape innovations that enable Intel to create world-changing technology that enriches the lives of every person on Earth.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
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674 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0284834
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