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About This Role
- About the Role Join Intel’s Advanced Packaging Technology and Manufacturing team and help shape the future of semiconductor packaging.
- In this role, you will develop and optimize cutting-edge equipment and processes that enable next-generation packaging solutions.
- Your work will directly impact product performance, manufacturability, and reliability at scale supporting innovations that power computing advancements globally.
- What You’ll Do Key responsibilities will include but not limited to : Develop, qualify, and optimize semiconductor packaging equipment and processes to meet quality, yield, cost, and reliability targets Apply statistical methods (DOE, SPC) to analyze process performance and drive continuous improvement Design and execute experiments to validate packaging technologies under environmental stress conditions (e.g., thermal cycling, humidity, mechanical forces) Collaborate cross-functionally with design, manufacturing, and suppliers to ensure scalable and manufacturable solutions Define equipment specifications and partner with vendors to meet technical and performance requirements Identify and resolve packaging-related reliability issues using data-driven approaches and failure analysis techniques Lead technical problem-solving efforts and contribute to process innovation initiatives Document findings and best practices through technical reports and knowledge-sharing forums Support standardization of qualification processes, quality systems, and engineering methodologies Behavioral traits that we are looking for : Strong analytical and problem-solving mindset Effective written and verbal communication skills Ability to work independently and collaboratively in a team environment Adaptability in a fast-paced, innovation-driven setting Continuous improvement mindset with attention to detail Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
- See Intel Benefits for more details.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
- Immigration Sponsorship Information Minimum Qualifications and Experience : Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience.
- Or a Master's degree in the same field with 2 years of experience and a PhD in the same field.
- Your experience described above must be in the following: Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- Mechanical design software such as SolidWorks or AutoCAD.
- Mechanical drawings and Geometric Dimensioning and Tolerancing.
- Preferred Qualifications and Experience : Demonstrated ability to lead technical innovation and manage complex, time-sensitive projects.
- Experience with high-precision manufacturing methods, including stamping and CNC machining.
- Understanding of semiconductor fabrication processes and packaging technologies.
- Familiarity with supply chain management in a manufacturing or materials qualification environment.
- Previous related work experience in a semiconductor foundry preferred.
- Be part of Intel's mission to innovate and advance the future of technology.
- Apply today to make an impact and shape the future of packaging solutions.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
95 positions
Job ID
/job/US-Arizona-Phoenix/Packaging-Module-Development-Engineer_JR0284377
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