Module Engineer within Assembly Engineering department

About This Role

• How would you like to work in an organization that provide diverse and inclusive workplace where everyone respects and builds trust with each other? Are you a passionate learner who’s always looking for opportunities to improve and innovate? If this is what you are looking for, Intel is the place to be! At Intel, we are always learning new things and pushing the boundaries…and that drives amazing experiences! We want you to dream big and help us take on some of the biggest technical challenges in the industry.
• Intel Vietnam is the largest factory in Intel’s global Assembly and Test network and a critical site for our IDM2.0 strategy.
• The clean room facility is located at Saigon High Tech Park in Thu Duc city, Ho Chi Minh city.
• The site is proud of producing Intel’s latest technology chip products including 5G, IoT, Desktop, Mobile, etc.
• We are looking welcome a Module Engineer into our team! A highly energetic individual with strong technical background to drive engineering solutions and enable new technology transfers.
• Module Engineer within Assembly Engineering Department Responsibilities: Empowered to lead critical resolution of operational needs for the Assembly process and equipment.
• Optimize advanced process control systems to detect signals and automate defect containment Define maintenance and calibration procedures, partnering with technicians and manufacturing teams to sustain equipment OEE standards.
• Responsible to engage and lead new technology development, product transfers and process integration.
• Discover breakthrough innovations in process and equipment, with a focus on generating patentable solutions Spearhead Factory of the Future transformation through AI and Robotics deployment Actively engaged in our Virtual Factory (VF) network, driving cross site learnings and problem resolution Qualifications: Bachelors or Masters degree in following Engineering fields – Electrical and Electronics, Mechanical, Mechatronics, AI/Robotics, Control & Automation, Computer Engineering (Computer Vision/Image Processing) and/or other related fields.
• Fresh graduates are invited to apply for the Module Engineer entry-level position.
• Strong English articulation and written communication skills.
• Self-motivated, team-oriented individual with a strong data driven mindset.
• Willingness to hand on and positive learning attitude.
• Preferred: Highly knowledgeable in statistical and problem-solving tools like 8D, FMEA, Lean Six Sigma methodology, JMP statistical analysis is a must for experience candidate Expertise in Machine Learning and Robotics with proficiency in Python, OpenVino, Tensorflow, C++, ROS (Robot Operating System), MATLAB, Gazebo, V-REP, Webots and familiarity with embedded systems and real-time programming.
• Preferred Experience in Advance Packaging, Package Technology Development and semiconductor packaging with specific focus on Equipment design, DFA/DFM design rules, PFMEA assessments and developing control plans to enhance process capability.
• Experience working with direct material, thermal mechanical and modelling.