Manufacturing Failure Analysis Engineer

About This Role

• The Role and Impact Join Intel's Advanced Packaging team as a Manufacturing Failure Analysis Engineer, where you will play a critical role in shaping the future of semiconductor manufacturing.
• This position is pivotal in ensuring the success of Intel's IDM 2.0 strategy and its global leadership in advanced packaging technologies.
• You will be instrumental in identifying and resolving failures across next-generation product, package, platform, and board process technologies to drive improvements in quality, yield, and reliability.
• Your expertise will directly contribute to innovative solutions that help connect and enrich the lives of people around the world.
• Key Responsibilities - Conduct failure analysis to identify root causes of issues in manufacturing processes, products, and technologies. - Define failure analysis strategies and execute lab work to evaluate electrical and mechanical characteristics of integrated circuits, components, and systems. - Develop and implement advanced electrical, analytical, and mechanical methodologies to ensure future-ready failure analysis capabilities. - Investigate the interactions between materials and devices to thoroughly understand fundamental failure mechanisms. - Recommend corrective actions based on failure reports and drive the proliferation of shared learnings across sites to enhance organizational knowledge. - Collaborate with cross-functional teams to enable new technology or product transfers, manufacturing startups, automation, and process improvements. - Ensure compliance with Standard Operating Procedures (SOPs) and best-known methods (BKMs) to maintain operational excellence. - Coordinate with internal and external partners, including third-party laboratories, to support failure analysis and special investigations.