ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION

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What You'll Do

  • Support chip‑package interaction (CPI) assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers.
  • Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics.
  • Participate in DFMEA / PFMEA activities by helping prepare inputs, reviewing risk items, and tracking action items.
  • Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue investigations.
  • Support execution of test vehicles and DOEs , including data collection, basic analysis, and report preparation.
  • Learn Micron’s package and silicon development flows, design rules, and change‑management processes.
  • Prepare technical documentation and presentation materials for design reviews, project updates, and knowledge sharing.
  • Escalate technical issues and risks promptly and seek guidance when encountering unfamiliar problems.
  • Required Qualifications Education & Experience Bachelor’s or Master’s degree in Engineering (Mechanical, Materials Science, Electrical, Chemical, or related discipline). < 2 years of relevant experience , including internships, co‑op programs, or research experience in semiconductor, materials, or manufacturing fields.
  • Technical & Professional Skills Fundamental understanding of semiconductor manufacturing and/or packaging concepts (coursework or internship level).
  • Exposure to structured problem‑solving methods (FMEA, DOE, data analysis) through academics or internships.
  • Ability to follow defined engineering procedures, analyze straightforward technical problems, and learn from feedback.
  • Strong attention to detail and willingness to learn new tools, processes, and technologies.
  • Basic proficiency in Microsoft Excel, Word, and PowerPoint for data analysis and documentation.
  • Good written and verbal communication skills, with the ability to collaborate effectively in a team environment.
  • About Micron Technology, Inc.
  • We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
  • With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
  • Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
  • To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg&#64;micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
  • Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
  • AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
  • However, all information provided must be accurate and reflect the candidate's true skills and experiences.
  • Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
  • Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

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Micron Technology

MSB, Singapore

Specialisation
Open roles at Micron Technology
3063 positions
Job ID
/job/MSB-Singapore/ENGINEER--PACKAGE-DEVELOPMENT-ENGINEERING--PACKAGE-SILICON-INTEGRATION_JR103831

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