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About This Role
- Position Overview Join Intel's Networking Platforms Operation as an Engineering Manager leading cutting-edge hardware design for FNIC and IPU board products.
- This player-coach role combines strategic leadership with hands-on technical expertise, managing a dynamic team of mechanical, thermal, and board layout engineers developing next-generation networking technology.
- Key Responsibilities Team Leadership & Strategy Lead and develop a cross-functional team of mechanical, thermal, and CAD engineers Define technology roadmaps for board design aligned with Intel's strategic objectives Translate customer requirements and product architecture into executable design solutions Coach and mentor team members in advanced technology development and career growth Technical Excellence & Innovation Drive development and implementation of innovative board product solutions Partner with engineering, product planning, and customer-facing teams to deliver industry-leading power, performance, and design solutions Establish strategic partnerships with industry leaders to foster innovation and research collaboration Develop long-term capability strategies for emerging technological requirements Operational Leadership Manage resources and priorities to meet aggressive project timelines Foster cross-team collaboration to maximize operational outcomes Set clear performance goals and maintain accountability for team results Promote an inclusive, high-performance work environment Qualifications: The Minimum qualifications are required to be initially considered for this position.
- Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research.
- The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Minimum Qualifications Bachelor's degree in Mechanical/Manufacturing Engineering or in a related field and 7+ years of experience 5+ years of leadership experience managing engineering teams 5+ years of experience with server platforms and data center technologies.
- Experience with cloud enterprise and telecommunications infrastructure applications Experience in heat transfer, CFD analysis, and materials selection for electronics cooling Experience with high-density PCB layout constraints and complex PCBA assembly integration Preferred Qualifications Post Graduate Degree in in Mechanical/Manufacturing Engineering or in a related field Proficiency in CAD software (SolidWorks preferred) Experience with thermal simulation tools (Ansys, FloTHERM, or equivalent) Background working with OEMs, ODMs, or contract manufacturing partners Experience in assembly and manufacturing processes What We Offer This role provides an exceptional opportunity to shape the future of networking technology while leading a world-class engineering team at one of the industry's most innovative companies.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $164,470.00-311,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
Open roles at Intel
745 positions
Job ID
/job/US-Oregon-Hillsboro/Manager---Mechanical-and-Thermal-Engineering_JR0283056
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