Advanced Packaging Flagship Curriculum Internship Program

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About This Role

  • As an intern in semiconductor industry, you will gain hands-on experience while collaborating with engineering teams to troubleshoot equipment, drive process improvements, and contribute to innovative solutions.
  • This is your opportunity to explore your potential, develop technical expertise, and contribute to Intel's mission to create world-changing technology that improves lives.
  • Key Responsibilities - Conduct literature surveys and technical assessments to inform process improvements and research efforts. - Perform materials characterization and apply principles of Design of Experiments (DOE) to validate hypotheses and drive innovation. - Develop and execute lab-scale experiments to advance understanding of process mechanics and improvements. - Contribute to technical documentation for projects, ensuring clarity and accessibility of results and methodologies. - Utilize computational tools, such as finite element analysis and computational fluid dynamics, to analyze and refine process designs. - Support research and development activities that align with Intel's business goals and future technology roadmaps.

Qualifications

  • This internship opportunity is specifically designed for undergraduate students who have completed the EBB302 Advanced Packaging Flagship Curriculum at Universiti Sains Malaysia (USM) and are required to undergo a compulsory industrial training/internship placement to satisfy USM academic requirements.

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Intel

Malaysia, Kulim

Specialisation
Open roles at Intel
745 positions
Job ID
/job/Malaysia-Kulim/Advanced-Packaging-Flagship-Curriculum-Internship-Program_JR0283207

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