Foveros Direct Pathfinding Integration

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Discover how your skills and expertise can have a lasting impact on Intel's industry-leading innovations.
Apply today to become part of the team shaping the future of semiconductor packaging technology.
Some of the responsibilities will include but not be limited to: You will apply scientific and engineering principles to design, develop, and qualify packaging solutions and materials used to hold, display, dispense, and safely transport all types of products.
Manage the packaging development process including packaging artwork development, concepts, prototypes, qualification testing, specification documentation, coordination with manufacturing, regulatory, logistics, and supply chain partners, vendor selection and qualification, manufacturing startup, and benchmarking.
Identifies and implements processes to drive efficiency, cost, manufacturability, waste reduction, sustainability, logistics, and/or packaging supply chain improvement opportunities.
Consult cross organizational partners on product launch, branding and marketing, SKU, barcodes and labeling, scaling, packaging supply chain, logistics, regulatory and compliance, and bills of material requirements for shipments into Intel's product distribution channel.

Bachelor's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 6+ years of relevant experience; or Master's degree in engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience; or PhD in Engineering, Materials Science, Chemistry, Physics, or a related field, and 4+ years of relevant experience.
Experience in packaging engineering, process development, and technology innovation.
Experience in thermal, mechanical, and electrical design concepts related to semiconductor packaging.
Expertise in qualification testing, specification documentation, and packaging material certification.
Preferred Qualifications Experience in advanced packaging technology development and strategic supplier management.
Hybrid Bonding Process development or Integration experience.
Experience with leading technology programs and engaging with cross-functional stakeholders.
Experience participating in forums, task forces, or working groups driving defect reduction and process improvements.

We offer a total compensation package that ranks among the best in the industry.
It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
Find out more about the benefits of working at Intel .
Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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