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About This Role
- The Role and Impact Join Intel's Packaging Module Development team as a Packaging Module Development Engineer and contribute to advancing innovative assembly and packaging technologies.
- In this role, you will develop and optimize processes and equipment to support next-generation packaging solutions.
- Your work will directly enhance manufacturing efficiency, product reliability, and quality, enabling cutting-edge products that shape Intel's leadership in the semiconductor industry.
- Business Group Intel's Packaging Module Development team focuses on designing and refining assembly and packaging solutions for Intel's diverse product portfolio.
- Collaborating with cross-functional teams, this group drives innovation in manufacturing processes and delivers high-quality, reliable solutions that support Intel's mission to deliver world-class technologies to global markets.
- Key Responsibilities Develop and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability goals.
- Apply principles of Design of Experiments (DOE) and Statistical Process Control (SPC) to refine processes and specifications, documenting findings through technical reports.
- Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as temperature cycles, humidity, heat, and dynamic forces.
- Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows.
- Define material specifications and collaborate with supplier quality and procurement teams to ensure adherence to quality and performance benchmarks.
- Innovate new techniques, tools, and quality screens to proactively identify and address packaging reliability challenges.
- Set reliability benchmarks based on a thorough understanding of failure mechanisms and customer needs.
- Lead problem-solving initiatives and drive continuous improvement in processes and equipment.
- Provide expert consultation to internal teams and partners on packaging challenges and technical solutions.
- Standardize equipment qualification practices and manufacturing quality systems to align with product milestones and mitigate technical risks.
Requirements
- Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 3+ years of relevant experience OR Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field, and 2+ years of relevant experience OR PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field.
Nice to Have
- Experience in the following: Program management ability to lead technical innovation and manage complex, time-sensitive projects.
- Semiconductor fabrication processes, packaging technologies, and robotics.
- Supply chain management in a manufacturing or materials qualification environment.
- Take the next step in your career and join Intel's team of innovators dedicated to shaping the future of technology.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $99,030.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
806 positions
Job ID
/job/US-Arizona-Phoenix/ATD-MIHL-Equipment-Development-Engineer_JR0288501
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