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About This Role
- The Role and Impact Join Intel as a Packaging Module Development Engineer in Laser Assembly and play a pivotal role in shaping the future of semiconductor packaging technologies.
- This position offers a unique opportunity to contribute to the development of cutting-edge processes and equipment that enable Intel to stay at the forefront of innovation.
- Your work will directly impact the performance, quality, and reliability of Intel's assembly and packaging solutions, driving advancements in technology that address the dynamic needs of the semiconductor industry.
- Through technical expertise and collaboration with cross-functional teams, you will help Intel achieve its mission of delivering world-class packaging solutions.
- Key Responsibilities - Design and develop laser assembly packaging processes and equipment to enable next-generation packaging technologies. - Optimize manufacturing processes to meet stringent quality, reliability, cost, yield, productivity, and manufacturability requirements. - Develop process and equipment specifications using Design of Experiments (DOE) and data analysis principles. - Oversee the manufacturability of physical layout designs and manage the full cycle of packaging processes, procedures, and flows. - Establish laser process specifications and collaborate with suppliers to meet quality and performance standards. - Innovate new techniques, tools, and quality screens for early identification of potential packaging quality and reliability issues. - Set laser process reliability requirements based on a strong understanding of failure mechanisms, influencing design, material selection, and process development. - Drive standardization in qualification procedures, manufacturing quality systems, and processes while collaborating with engineering teams to meet critical milestones. - Influence material selection, process design, and equipment development to align with customer needs and product requirements.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Requirements
- Bachelor's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 4+ years of industry experience. -OR- Master's degree in Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 3+ years of industry experience. - OR- PhD in Engineering, Physics, Mechanical Engineering, Optical Engineering, or a related STEM field with 6 months+ of Industry experience.
- Industry Experience should include the following: - Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques. - Demonstrated experience applying engineering principles to develop innovative laser solutions for packaging processes and equipment. - Strong analytical skills with expertise in data analysis, risk assessment, and problem-solving methodologies.
Nice to Have
- Hands-on experience in a technology manufacturing environment or semiconductor packaging processes and troubleshooting laser based equipment/systems. - Familiarity with equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly. - Demonstrated ability to collaborate with cross-functional teams and deliver results in time-sensitive projects. - Capability to apply Data Science and Statistics tools (Python, Numpy/Pandas, SQL, JMP, Minitab) to manipulate large complex data sets.
- We invite you to bring your expertise, creativity, and passion for technology innovation to Intel.
- Join us in driving the future of semiconductor packaging and make a lasting impact on the technology landscape.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-219,550.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
632 positions
Job ID
/job/US-Arizona-Phoenix/ATD-Experienced-Laser-Development-Engineer_JR0285438
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