Advanced Packaging Process Integration Engineer

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About This Role

  • The Role and Impact As a Process Integration and Yield Engineer, you will play a pivotal role in driving Intel's mission to deliver world-class semiconductor solutions.
  • This role offers an exciting opportunity to define and execute technology transfer roadmaps, enabling the seamless integration of advanced packaging and backend assembly-test processes from new product introduction (NPI) to high-volume manufacturing (HVM) ramp.
  • You will lead critical yield and quality improvement initiatives, ensuring optimal manufacturing performance.
  • Your expertise will contribute to Intel's commitment to delivering innovative and reliable products that power the world's cutting-edge technologies.
  • Key Responsibilities - Define and establish process flows, procedures, and equipment configurations to enable successful technology transfer. - Analyze large volumes of structured and unstructured data, extracting actionable insights using statistical and machine learning methods, as well as coding tools such as SQL and Python. - Drive yield improvement initiatives by identifying and resolving low-yield issues, engaging with both internal and external stakeholders. - Implement continuous improvement programs to proactively prevent quality, line yield, and sort yield excursions. - Perform quality and reliability risk assessments for manufacturing materials and process changes. - Mentor and develop technical talent within the team, fostering a culture of innovation and collaboration. - Act as a change agent to align organizational goals with technical strategies, driving innovation and leadership in the semiconductor industry.

Requirements

  • are required to be initially considered for this position.
  • Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
  • Minimum Qualifications - Bachelor's degree in Engineering, Material Science, Physics, or a related field with 4 or more years of relevant experience, or a Master's degree in Engineering, Material Science, Physics, or a related field with 3 or more years of relevant experience, or a PhD in Engineering, Material Science, Physics, or a related field with no experience.
  • Experience listed above should be a combination of the following: - Process integration, yield analysis, and quality management in TD or high-volume manufacturing environments. - Semiconductor advanced packaging and backend assembly-test process development.
  • Preferred Qualifications - Data analysis tools and programming languages such as SQL, Python, or related coding tools. - Proven ability to lead cross-functional problem-solving initiatives and drive results in a complex and fast-paced environment. - Strong communication skills with the ability to effectively collaborate across diverse teams and stakeholders. - Experience in value engineering and an innovative mindset to identify cost-effective solutions. - A demonstrated track record of mentoring and developing technical talent in a professional setting.
  • Join us and seize the opportunity to shape the future of technology, make meaningful impacts on a global scale, and contribute to the advancement of the semiconductor industry.

Benefits

  • We offer a total compensation package that ranks among the best in the industry.
  • It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel .
  • Annual Salary Range for jobs which could be performed in the US: $120,860.00-170,630.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
  • Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
  • Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

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Intel

US, New Mexico, Albuquerque

Specialisation
Open roles at Intel
632 positions
Job ID
/job/US-New-Mexico-Albuquerque/Advanced-Packaging-Process-Integration-Engineer_JR0285147

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