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About This Role
- The role is for APTM-TD (Advanced Packaging Technology Manufacturing - Technology Development) assembly module internship in Malaysia.
- Responsibilities and scopes may be quite diverse depending on the function or project assigned.
- The modules within the scope of this role include MIHL (Media, Inspection, Handling, and Lasermark), TCB (Thermal Compression Bonding, CAM (Chip Attach Module), SLAM (Second Level/Ball Attach Module), DXA (Direct Lid or Stiffener Attach), and CUF (Capillary Under Fill).
- In general, supports the development and implementation of respective assembly process for a specific module in semiconductor manufacturing.
- Collaborates with engineering teams to optimize process control methodologies and ensure production targets are met.
- The industrial exposure and technical skill learned through hands on experience and projects that support Intel business goals in a collaborative environment will enhance the students knowledge and experience for their future career undertaking.
Qualifications
- This internship is only open for the undergraduate student who has taken the Advanced Packaging Flagship Curriculum and required to undergo the internship program by USM academic plan.
Nice to Have
- Specific interest in any package assembly process (material handling systems, lasermark, inspection, chip and component attach reflow, thermal compression bonding, direct lid and stiffener attach, ball attach, etc.) Job Type: Student / Intern Shift: Shift 1 (Malaysia) Primary Location: Malaysia, Kulim Additional Locations: Business group: Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly.
- We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.
- Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
745 positions
Job ID
/job/Malaysia-Kulim/Advanced-Packaging-Flagship-Curriculum-Internship-Program_JR0282198
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