Advanced Packaging Dry Etch Module Development Engineer

Requirements

• are required to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Minimum Qualifications - Master or PhD degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Chemistry, Physics, or a related field. - Master's degree with at least 4 years of experience, or PhD with at least 2 years of experience.
• Experience listed above should be a combination of the following: - Process development engineering within semiconductor manufacturing, including wafer-level assembly or advanced packaging processes. - Design of Experiments (DOE), process development methodology, statistical process control, and/or manufacturing process improvement. - Experience with plasma etch equipment platforms Preferred Qualifications - Experience in wafer-level assembly, advanced packaging, or related technologies. - Demonstrated success in leading programs from initial strategy development through high-volume production. - Technical leadership experience in solving complex engineering challenges and driving industry-leading solutions. - Strong cross-functional collaboration skills with stakeholders in yield, operations, and other functional areas.
• Intel is looking for forward-thinking, skilled engineers who are passionate about advancing the boundaries of semiconductor technology.
• Join us to help shape the future of innovation.
• Apply now and become a part of Intel's mission to create world-changing technologies that improve lives.