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About This Role
- The Role and Impact As a Packaging Module Development Engineer, you will drive the design and optimization of innovative packaging processes and equipment essential to Intel's next-generation semiconductor technologies.
- Your day-to-day responsibilities will include developing solutions to enhance reliability, manufacturability, and performance in high-volume manufacturing environments.
- These contributions will play a critical role in advancing Intel's leadership in semiconductor packaging technologies.
- Business Group This role is part of Intel Corporation's Advanced Packaging Technology Manufacturing (APTM) organization, which focuses on developing and scaling cutting-edge semiconductor packaging solutions.
- APTM supports Intel's broader mission by delivering technologies that empower high-performance, edge, and mobile computing applications, enabling global customer success and technological leadership.
- Key Responsibilities Develop, optimize, and qualify packaging assembly processes, materials, and equipment to meet quality, reliability, yield, and cost targets.
- Drive experimental design using methodologies such as Statistical Process Control (SPC) and Design of Experiments (DOE).
- Innovate new techniques, materials, and tools to address emerging challenges in packaging reliability and manufacturability.
- Collaborate with cross-functional teams to mitigate technical risks and ensure product development success.
- Establish process specifications and material requirements while working with suppliers to meet stringent quality standards.
- Document technical findings, process improvements, and advancements through detailed reports and technical papers.
- Provide support for equipment performance and process health in both development and high-volume manufacturing environments.
- Core Competencies Strong communication skills to collaborate across diverse teams and stakeholders.
- Strong analytical skills, including data analysis and risk assessment to inform decision-making.
Requirements
- are required to be initially considered for this position.
- Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research.
- The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Requirements
- Bachelor's degree in Engineering, Physics, Chemistry, or a related STEM field with 3+ years of industry experience. -OR- Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 2+ years of industry experience. -OR- PhD in Engineering, Physics, Chemistry, or a related STEM field with no prior professional experience.
- Experience with process development and/or equipment qualification for manufacturing applications.
- Preferred Qualifications Experience leading technical teams and collaborating across matrixed organizations to drive innovation.
- Experience in Statistical Process Control (SPC), Design of Experiments (DOE), and process characterization techniques Experience with semiconductor fabrication processes, packaging flows, and assembly methodologies.
- Proven ability to deliver results in time-sensitive technical projects with a focus on process improvement.
- Knowledge of quality systems, documentation standards, and tools for packaging reliability evaluation.
- Proficiency in programming languages such as Python, MATLAB, or SQL to analyze complex datasets.
- Join Intel's world-class technology development team and use your expertise to push the boundaries of innovation in semiconductor packaging.
- Take the next step in your career and apply today to help shape the future of technology.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
806 positions
Job ID
/job/US-Arizona-Phoenix/Advanced-Packaging-Development-Engineer_JR0288290
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