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What You'll Do
- Perform wire bond process task on quality hold material 2.Collaborate with engineering to improve WB processes and techniques. 3.Assist in resolving WB-related issues to minimize production downtime.
- Requirements: 1.Diploma or above in Engineering or a related field. 2.Working experience with WB process is preferable and recommended 3.Strong attention to detail and technical troubleshooting skills. #LI-DNI
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Specialisation
Open roles at NXP Semiconductors
786 positions
Job ID
/job/Kuala-Lumpur/Wire-bond-process-tech_R-10065961
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