Senior Thin Films Process Engineer

Overview

• NXP’s Austin Technology and Manufacturing Center (ATMC) has an immediate opening for a Senior Thin Films Process Engineer.
• ATMC is NXP’s most advanced internal 200mm high volume manufacturing wafer fab, producing Automotive and Industrial products with our 90nm - 250nm Copper and Aluminum Process Technologies.
• The position requires ownership and responsibility for process control, process development, and optimization of semiconductor processes and equipment.
• This role plays a critical part in ensuring high levels of product quality, yield and process stability in a high-volume manufacturing environment.
• The ATMC Films Process Engineering group is responsible for all PVD, CVD and RTA processes within the factory.
• Key Challenges Develop and optimize processes for silicon semiconductors.
• Implement and maintain SPC (Statistical Process Control) and FDC (Fault Detection and Classification) systems.
• Analyze metrology data to monitor material quality and drive improvements.
• Reduce defectivity mechanisms and improve process control.
• Participate in and/or lead cross-functional teams to exceed factory and functional area level Safety, Quality, Delivery and Cost goals.
• Solve complex process and integration problems utilizing electrical, chemical and physical analysis techniques.
• Lead troubleshooting and root cause analysis (8D/3x5WHY/Fishbone) for process deviations and yield issues.
• Work with minimal supervision, balancing competing priorities, to serve the needs of the engineering and manufacturing communities.
• Drive equipment performance to maximize capacity and yield performance.
• Improve cost performance of processes, equipment and production flows.
• Demonstrate Technical Leadership through mentoring engineers and technicians to further develop the team.
• Job Qualifications Education: B.S., Masters or Ph.D degrees in Chemical, Materials Science, Mechanical or Electrical Engineering.
• Job Experience: Greater than 10 years working in the Semiconductor Industry, within a High Volume Manufacturing wafer fab.
• Less is acceptable with advanced degrees (Masters/Ph.D).
• Direct experience owning PVD, CVD or RTA processes.
• Hands-on experiences with Applied Materials 5500 Endura PVD, Applied Materials 5200 Centura CVD/RTA, Applied Materials Producer CVD or Novellus HDP CVD systems.
• Experience with install, start-up, qualification and release to production of PVD, CVD or RTA tools.
• Experience with supporting or leading New Product Introduction / New Technology Introduction Factory Level Projects.
• Experience using DOEs to optimize and improve either existing or new processes.
• Positive interpersonal skills, highly energetic and self-motivated.
• Excellent verbal and written communication skills.
• Statistical Analysis skills: Six Sigma Green Belt or Black Belt preferred.
• More information about NXP in the United States..
• NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
• In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.