Process Integration Device Engineer

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What You'll Do

  • Role Purpose Lead the development, integration, and transfer of HV/BCD semiconductor technologies, serving as the key technical interface between NXP and external foundries in China.
  • This role ensures that process integration, device performance, and reliability fully meet NXP product and business requirements through strong device physics expertise and cross-functional leadership.
  • Process Integration & Technology Transfer Act as a Process Integration / Device Engineer in HV and BCD technology development and transfer projects.
  • Ensure external foundries correctly understand and implement NXP technology and device requirements.
  • Define and communicate technical specifications; review foundry implementations and assess alignment with NXP needs.
  • Analyze process integration deviations and their impact on performance, yield, and reliability.
  • Propose and drive corrective solutions to align foundry implementations with NXP standards.
  • Device & Physics Leadership Lead or strongly contribute to HV/BCD device architecture development and optimization (LDMOS, EDMOS, ESD).
  • Analyze key device physics parameters including breakdown voltage (BV), Rdson, SOA, and reliability.
  • Utilize TCAD (2D/3D) simulations to accelerate development cycles and root-cause analysis.
  • Support device verification through statistical analysis of DOE and WAT data.
  • Cross-functional & External Collaboration Collaborate closely with internal Business, Design, Design Enablement, PI, and PE teams.
  • Serve as the primary technical interface to foundries in China, leading technical discussions and decision-making.
  • Drive projects to timely completion in support of NXP business and product roadmaps.
  • Requirements: Required Qualifications Master’s or Ph.D. in Electrical Engineering, Solid-State Physics, or Materials Science. 10+ years of semiconductor industry experience in process integration or device engineering.
  • Profound knowledge of HV and BCD technologies.
  • Strong experience in technology development and/or transfer projects with foundries.
  • Hands-on experience with TCAD tools (Sentaurus / Silvaco); familiarity with JMP and Cadence is a plus.
  • Fluent in English with the ability to communicate technical concepts clearly; Mandarin proficiency required.
  • Competencies Technical Ownership: Strong accountability for technical quality, robustness, and project outcomes.
  • Critical Thinking: Ability to diagnose complex process and device issues using data-driven methods.
  • Collaboration: Effective communicator across multicultural, cross-functional, and external teams.
  • Decision Making: Balances device physics, process integration, and business needs in technical decisions.
  • More information about NXP in Greater China... #LI-67af

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NXP Semiconductors

Shanghai (JingAn)

Specialisation
Open roles at NXP Semiconductors
630 positions
Job ID
/job/Shanghai-JingAn/Process-Integration-Device-Engineer_R-10063267

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