Opens nxp.wd3.myworkdayjobs.com in a new tab

What You'll Do

  • – Advanced Power Management & System IC Architecture Product Definition & Strategy Own System IC Architecture, to define product concepts and specifications for power semiconductor modules and System-in-Package (SiP) solutions.
  • This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Develop and maintain long-term product and technology roadmaps in collaboration with product line leaders and R&D teams.
  • Translate customer requirements into innovative packaging and power management solutions.
  • This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Support development through thermal optimization and electrical analysis.
  • System-Level Integration Partner with system solution architects and IC product architects to ensure solutions meet stringent performance, efficiency, space, and cost targets.
  • Lead integration of ICs and power semiconductors into advanced packages and systems.
  • This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Expertise in System-in-Package (SiP) integration is essential.
  • Drive early-phase engineering and architecture for AI compute, automotive 48V systems, and electrification platforms.
  • Knowledge of AI Compute Power Solutions is critical.
  • Automotive Power Management experience is a plus, highly valued.
  • Technical Advisory & Reporting Provide strategic insights on state-of-the-art power management technologies and benchmark readiness.
  • This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Analyze customer-specific needs to deliver optimized power efficiency and thermal management strategies for enhanced reliability.
  • This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Report KPIs and project status to executive stakeholders.

Nice to Have

  • Master’s degree in Power Electronics, Electrical Engineering, or related field (Ph.D. preferred). 15+ years of experience in power semiconductors, packaging, and system-level integration.
  • This role emphasizes Advanced Power Management for Point of Load (PoL) solutions.
  • Expertise in System-in-Package (SiP) integration is essential.
  • Proven track record in product definition through revenue realization.
  • Strong expertise in thermal management, electrical performance, and advanced reliability.
  • Proficiency in circuit simulation tools (e.g., Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, Verilog-AMS) and knowledge of PCB materials and stack-up.
  • Experience in Powering high performance compute SoC platforms, with automotive-grade standards highly valued.
  • Experience in systems developed according to Functional Safety standard is a plus (ISO26262 and/or IEC61508).
  • Demonstrated ability to lead cross-functional, global teams and manage complex projects.
  • Excellent communication and interpersonal skills; ability to collaborate across diverse teams.
  • Creative mindset with strong problem-solving capabilities.
  • Willingness to travel globally.
  • More information about NXP in the United States...
  • NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law.
  • In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals. #LI-6aa0

Sourced directly from NXP Semiconductors’s career page

Your application goes straight to NXP Semiconductors.

Specialisation
Open roles at NXP Semiconductors
630 positions
Job ID
/job/Austin-Oakhill-Office/Systems-IC-Architect_R-10063523

Get matched to roles like this

Upload your resume once. We’ll notify you when matching roles open up.

Join talent pool — free

Similar Other roles