Process and Equipment Tech

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Overview

  • Plating Process Technician Carryout the following activities Set up Plating Line as process specification Setting up recipes based on product requirement Set up and maintenance of plating baths and miscellaneous related equipment related to electroplating Responsible for chemical addition based on lab analysis Chemical Filtration & Leaching activity Anode Top Up for respective plating lines Requirement: 1) Diploma in Engineering (Chemical, Mechanical) or related 2) Previous experience in electroplating in semiconductor assembly Plating Equipment Technician Carryout the following activities Set up Plating Line Loader and Unloader Change Over of Loader and Unloader Carryout periodical maintenance for plating machine Maintenance of plating machine fittings Replacement of Plating Pumps and Rectifiers Serving Pumps and Blowers Requirement: 1) Diploma in Engineering (Electric/ Electronic, Mechanical) or related 2) Previous experience in electroplating in semiconductor assembly #LI-DNI.

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NXP Semiconductors

Kuala Lumpur

Specialisation
Open roles at NXP Semiconductors
541 positions
Job ID
/job/Kuala-Lumpur/Process-and-Equipment-Tech_R-10057707

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