Packaging Development Engineer

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What You'll Do

  • Lead, plan, and execute projects related to process assembly development and validation Design, execute, and analyze process related experiments Use software to analyze data including statistical analysis Solve process issues using creative problem solving techniques Create process recipe for packaging development, qualify and transfer for high volume production Set up new specifications and procedures for production Initiate sharing of lesson learnt and best practices among manufacturing sites Lead / participate in Task Force Teams Identify risks and actions for risk mitigation manufacturing operation Lead / support process qualification activities Requirements: Minimum Bachelor’s degree in Engineering or Sciences (or related field).
  • Master or PhD holder is preferred.
  • Good aptitude in statistical data analysis and problem solving skills Must exhibit pro-activeness in leading process characterization work, ability to take on new challenges an embrace changes Basic knowledge of project planning and experience in driving small projects Excellent communication and presentation skills Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams Must be committed to meet process / project deadlines and commitments More information about NXP in Malaysia... #LI-633a

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NXP Semiconductors

Kuala Lumpur

Specialisation
Open roles at NXP Semiconductors
732 positions
Job ID
/job/Kuala-Lumpur/Packaging-Development-Engineer_R-10064339-1

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