Package Design Engineer

What You'll Do

• Responsible for all aspects of package design from concept through best in class solution with optimal cost, manufacturability, performance and reliability.
• Utilize various industry standard die / package co-design and layout tools for design.
• Participate in die/package/PCB codesign activities, supporting critical signal paths, package architecture, floorplanning, bump maps, stackups, and routing implementation.
• Design and optimize package structures for RF and mmWave applications, including controlled-impedance routing, grounding, shielding, and signal-launch structures.
• Collaborate with simulation engineers to evaluate electrical performance, SI/PI, EM behavior, and implement design improvements.
• Support package design reviews, manufacturability assessments, design-rule compliance, and release documentation.
• Partner with assembly sites, OSATs, substrate suppliers, and cross-functional teams to deliver robust, manufacturable package solutions.
• Provide technical guidance on package architecture, substrate technologies, assembly processes, and RF package implementation.
• Qualifications Bachelor's or Master's degree in Electrical, Mechanical, Materials Engineering, or equivalent.
• Technical experience in the following areas: Five plus years direct experience designing flip chip and wire-bond substrate-based and WLCSP/FOWLP semiconductor packages.
• Expert proficiency with Cadence Allegro Package Designer (APD) and AutoCAD required.
• Experience with die-package-PCB codesign methodologies desired.
• Knowledge of Power Integrity and Signal Integrity (PISI) and high-speed signal routing, differential pair implementation, return-path management, and impedance-controlled interconnect design a plus.
• Strong understanding of substrate technologies including design rules as well as Geometric Dimensioning and Tolerancing.
• Experience with or extensive exposure to primarily analog SoC design prefrred.
• Personal Attributes Effective written, verbal and presentation communication skills.
• Strong technical leadership and problem-solving skills.
• Demonstrated ownership and accountability for technical deliverables.
• Self-motivated and capable of driving technical execution with minimal supervision.
• Strong collaboration and teamwork skills in a global engineering environment.
• More information about NXP in the Netherlands... #LI-c856