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Overview
- Equipment engineer with ME/EE background to fulfill tasks below.
- Design wire bond related parts / tool 2.
- Rationalize machine preventive maintain frequency 3.
- Cooperate with process engineer to evaluate new wire bond machine 4.
- Training line repair technician 5.
- Spare parts lifetime evaluation and safety stock management 6.
- Standardize machine repair procedure 7.
- Capability to overhaul wire bond machine 8.
- Cooperate with IT for production system build up and sustain More information about NXP in Greater China..
Sourced directly from NXP Semiconductors’s career page
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Specialisation
Open roles at NXP Semiconductors
616 positions
Job ID
/job/Kaohsiung/EQUIPMENT-ENGINEER_R-10063168-1
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