TECHNICAL PROGRAM MANAGER, PDE CEM

What You'll Do

• Program & Execution Leadership Own end‑to‑end program management for advanced packaging initiatives (e.g., 3DS, FC‑BGA, advanced wirebond, 2.5D/3D packages ) from concept through HVM ramp Define and manage program plans, milestones, critical paths, and dependencies Drive execution against schedule, cost, yield, and quality KPIs Proactively identify technical and execution risks , lead mitigation plans, and drive decision closure Cross‑Functional & Cross‑Site Coordination Partner with Packaging PDE, Assembly Integration R&D, Product Engineering, Quality, Supply Chain, Equipment, and Manufacturing sites Lead global, cross‑site program coordination (e.g., recipe/process transfer, site readiness, ramp alignment) Facilitate governance forums, technical reviews, and executive readouts New Product Introduction (NPI) Drive NPI execution for packaging technologies , including: Process and package readiness Deliverable tracking (PRD/TRD/PITD/QATD or equivalent) Risk & maturity assessments Ensure alignment to business priorities, customer requirements, and manufacturing constraints Technical Program Management Translate technical development work into executable plans with clear ownership Track progress across process development, equipment readiness, tooling, materials, and yield improvements Support technology transfer, scale‑up, and factory deployment of new packaging capabilities Communication & Stakeholder Management Provide clear, concise, executive‑ready program updates Maintain single source of truth for program status, issues, and decisions Influence without authority and align diverse stakeholders around common objectives Continuous Improvement & Best Practices Drive program management best practices , standardization, and lessons learned Support transformation initiatives (automation, dashboards, data‑driven execution) Mentor junior program managers where applicable Qualifications Education Bachelor’s or Master’s degree in Engineering (Mechanical, Materials, Electrical, Chemical, Semiconductor‑related fields) PMP or equivalent certification preferred (not mandatory) Experience 8–15+ years in semiconductor industry with exposure to assembly / packaging / manufacturing 5+ years of technical program or project management experience in complex, cross‑functional environments Strong familiarity with: Advanced packaging technologies (FC, WB, HBM, 2.5D/3D) Semiconductor NPI and manufacturing flows Yield, quality, and reliability fundamentals Core Skills Strong program execution discipline Ability to operate at the intersection of technical depth and schedule control Excellent communication, stakeholder management, and executive presence Proven ability to manage ambiguity, competing priorities, and global teams Success Metrics On‑time delivery of packaging programs Smooth NPI and HVM ramp with minimized technical escapes Effective cross‑site alignment and issue resolution High credibility with engineering and leadership teams Typical Interfaces Packaging Development Engineering (PDE / ATPDE) Assembly Integration R&D Manufacturing Engineering & Operations Quality & Reliability Supply Chain & Procurement Program Management Offices (PMO) About Micron Technology, Inc.
• We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
• With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
• Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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