Senior/Staff Engineer Process Simulations APTD

What You'll Do

• Partner with process engineering teams to understand semiconductor packaging processes and develop robust FEA, solid & flow simulations, and analytical simulation models .
• Guide test vehicle development to improve simulation correlation with empirical data; develop test plans as needed to verify models and validate analysis approaches against test outcomes.
• Participate in the development and advancement of simulation modeling methodologies across structural, thermo‑structural, flow, thermal, and other multiphysics domains .
• Perform structural, thermal, and flow simulations for semiconductor packaging processes to predict behavior, assess risks, and enhance process and product performance.
• Provide process and equipment simulation reports to support pathfinding, technology development, and product introduction .
• Communicate FEA and flow simulation results (preferably leveraging CFD) analysis results clearly to process engineers, providing actionable technical insights, design recommendations, and risk assessments .
• Mentor and mature organizational analysis capability across structural, thermal, and flow technology domains .
• Requirements Strong educational background or hands‑on experience in solid mechanics, finite element methods (FEA) with expertise in multiphysics modeling and simulation.
• Good understandings of fluid mechanics, thermodynamics, heat & mass transfer, kinetics, computational fluid dynamics (CFD) would be beneficial.
• Proven ability to understand and model multiphysics interactions , including setting up integrated multiphysics frameworks for analysis, measurements, and validation in IC packaging and related areas.
• Solid foundation in mechanics, physics, and chemistry , with emphasis on both analytical methods and measurement techniques .
• Extensive experience with high‑fidelity FEA including static, dynamic, thermal, flow, and coupled multiphysics analyses .
• Experience in static/ dynamic/ thermal analysis and multi-physics modeling with ability to handle convergence issues due to large deformations, large strains, plasticity, creep, viscoplasticity, viscoelasticty and contact.
• In‑depth knowledge of material properties, material characterization techniques, fatigue life prediction, creep damage assessment, and measurement methods relevant to IC packaging.
• Proficiency in commercial simulation tools such as , Ansys Mechanical, APDL, ACT, DesignModeler, and SpaceClaim with experience in CAD tools (AutoCAD, SolidWorks) .
• Knowledge of working with Ansys Fluent or Star‑CCM+ would be beneficial.
• Strong understanding of semiconductor packaging processes, materials, and technology trends , including but not limited to dicing, backgrinding, die attach, PECVD, cryogenic cleaning, organic substrates, over‑molding materials, wire‑bonding, and C4 / Cu pillar attachment methods .
• Ability to understand failure mechanisms and develop both analytical and FE‑based models to explain and predict failure modes.
• Experience in defining and executing numerical and/or laboratory experiments to evaluate feasibility and validate concepts and solutions for new package technology development .
• Strong inclination toward leveraging AI/ML techniques to reduce simulation iterations, accelerate convergence, and improve modeling efficiency.
• Ability to turn simulation outcomes into scalable, easy‑to‑use tools or workflows for broader engineering adoption.
• Excellent oral and written communication skills , with the ability to collaborate effectively in cross‑functional, multidisciplinary team environments .
• Degree required: MS/M.Tech with 6 Years or PhD with 1 to 2 years’ experience Mechanical Engineering, Materials Engineering, Physics, or related discipline About Micron Technology, Inc.
• We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
• With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
• Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
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