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What You'll Do
- Define and own 3 –10-year technology roadmap; identify technology inflection points Anticipate and solve long range fundamental technology barriers – interconnect scaling, hybrid bonding yield, thermals, warpage, reliability and defectivity with multi-die complexes Partner with senior leadership and technologists to inform corporate level packaging strategy and investment priorities Breakthrough problem solving for critical technical roadblocks Mentor and develop next generation of advanced packaging technologists Champion a culture of technical rigor, innovation, intellectual curiosity, and decision frameworks Generate high-value IP in advanced interconnect architectures and materials and process innovations Incubate next-generation platform technologies Required Qualifications Ph.D. in Materials Science and Engineering, Electrical Engineering, or related technical field required Minimum 15 years of technical experience in advanced semiconductor packaging technologies with demonstrated expertise in processes such as hybrid bonding, 3D integration, heterogeneous integration, and interconnect scaling Proven track record developing and implementing breakthrough packaging technologies from research through high-volume manufacturing Experience defining long-term technology roadmaps and informing corporate-level investment strategy for next-generation packaging platforms Demonstrated ability to mentor and develop technical talent with measurable impact on engineering capability The ability to bridge fundamental research to production implementation is critical.
- Leadership positions in major professional societies and /or experience as strategic advisor in either the private or public sector is preferred About Micron Technology, Inc.
- We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all .
- With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands.
- Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
- To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com .
- Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
- Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
- AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
- However, all information provided must be accurate and reflect the candidate's true skills and experiences.
- Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
- Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
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Open roles at Micron Technology
2991 positions
Job ID
/job/Taipei---MTT-office-Taiwan/Fellow--Advanced-Packaging_JR104508
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