Director – Package Materials Integration, APTD

What You'll Do

• will include, but are not limited to: Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs.
• Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.).
• Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs.
• Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines.
• Partner with process engineering, equipment development, and process integration leaders to ensure all TD deliverables are met and that regional teams operate with aligned priorities and decision-making.
• Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions.
• Lead development of novel materials solutions in conjunction with advanced packaging and product teams to recommend optimum package solutions that meet electrical, mechanical, thermal, reliability, cost, and system-level requirements.
• Interface closely with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path from pathfinding through development and into high-volume manufacturing.
• Successful candidates for this position will have: Demonstrated success leading technical organizations with a strong foundation in structured problem solving.
• Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures.
• Experience and working knowledge with materials used throughout the advanced packaging flow.
• Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem.
• Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies.
• Knowledge in materials-package interactions.
• Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle.
• Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Proven people leadership with experience managing managers and/or senior technical leaders across geographies, including direct reports in both the U.S. and Asia.
• Demonstrated ability to set organizational direction, develop talent, and drive technical excellence through cross-functional and cross-regional teams.
• Required Experience: Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering.
• PhD preferred. 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging. 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions.
• Strong understanding of semiconductor process integration and process development.
• Proven program and organizational leadership skills, with experience driving cross-functional technical teams, influencing executive stakeholders, and delivering results through others.
• Experience with advanced memory packaging is a plus.
• As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .
• Micron is proud to be an equal opportunity workplace and is an affirmative action employer.
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• To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
• Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
• AI alert : Candidates are encouraged to use AI tools to enhance their resume and/or application materials.
• However, all information provided must be accurate and reflect the candidate's true skills and experiences.
• Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
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