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About This Role
- The Role and Impact We are seeking a Senior Strategic Program Leader to drive the next generation of Yield and Defect Engineering transformation within a high-volume semiconductor manufacturing environment.
- This role goes beyond traditional engineering leadership serving as a catalyst for AI-driven innovation, enterprise scale program execution, and cross-functional alignment.
- You will lead a multidisciplinary organization responsible for advancing defect metrology, yield engineering systems, and AI-enabled decision intelligence, ensuring the factory operates with predictive, adaptive, and scalable capabilities.
- Your leadership will directly shape how data, automation, and artificial intelligence are embedded into daily operations to accelerate yield learning, improve cycle time, and increase productivity.
- As a key member of the technology and manufacturing leadership team, you will define long-term strategy, influence roadmaps across process integration and metrology, and drive execution of complex, high-impact programs that position the organization for future technology nodes and advanced packaging innovations.
- Key Responsibilities Strategic Leadership and Transformation: Define and execute a multi-year strategy for Yield and Defect Engineering, integrating AI/ML, automation, and digital transformation into core workflows.
- Lead enterprise-level programs to transition from reactive analysis to predictive and prescriptive yield management systems.
- Serve as a thought leader in AI adoption for semiconductor manufacturing, identifying high-value use cases and scaling solutions across sites.
- AI-Driven Productivity and Decision Intelligence: Champion the deployment of AI/Agentic AI solutions to enhance defect detection, classification, excursion prevention, and root cause analysis.
- Drive integration of data platforms, digital twins, and advanced analytics into yield and defect systems.
- Partner with data science, IT, and automation teams to embed real-time decision intelligence into fab operations.
- Operational Excellence and Yield Performance: Oversee yield performance across development and high-volume manufacturing, ensuring alignment to aggressive yield, quality, and delivery targets.
- Lead cross-functional efforts to resolve complex yield limiters and defect excursions, minimizing impact to supply.
- Institutionalize closed-loop learning systems that accelerate yield ramp and improve defect pareto convergence.
- Defect Metrology and Systems Leadership: Define and evolve defect metrology strategy, including tool selection, capability roadmaps, and system architecture.
- Lead development of scalable defect management systems that enable early detection, excursion containment, and predictive risk mitigation.
- Ensure alignment of inspection, review, classification, and analytics ecosystems with future technology requirements Program Execution and Stakeholder Influence: Drive large-scale, cross-site programs requiring alignment across process integration, manufacturing, equipment, and corporate strategy teams.
- Operate across multiple disciplines translating executive vision into clear roadmaps, measurable milestones, and disciplined execution.
- Influence senior stakeholders and executives to align investments, priorities, and organizational focus.
- Organization and Talent Leadership: Build and lead a high-performing, diverse organization, fostering a culture of innovation, accountability, and continuous learning.
- Develop next-generation leaders with capabilities spanning engineering depth, data science, and AI fluency.
- Champion a shift from individual based to scalable, system-driven excellence.
Requirements
- Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field (advanced degree preferred). • 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration. • Proven track record leading complex, cross-functional programs in high-volume manufacturing environments. • Demonstrated experience driving yield improvement and defect reduction at scale, including ramp and HVM phases. • Strong domain expertise in defect metrology tools, inspection systems, and yield analysis methodologies. • Experience integrating data analytics, machine learning, or AI solutions into engineering workflows. • Exceptional leadership and communication skills with ability to influence across organizational boundaries.
- Preferred Qualifications • Advanced degree (MS/PhD) in a relevant technical or data-centric discipline. • Experience leading AI/ML transformation initiatives in semiconductor or adjacent high-tech industries. • Familiarity with digital manufacturing ecosystems (data platforms, MES integration, advanced analytics tools). • Track record of defining and scaling enterprise-level engineering systems or platforms. • Strong business acumen with ability to connect technical outcomes to cost, cycle time, and revenue impact. • Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneous integration) is a plus.
- Join our team and be part of shaping the future of technology through your leadership and expertise.
- Apply today to make an impact.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $265,480.00-374,800.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Salary range
₹4-10 LPA to ₹40-75 LPA
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664 positions
Job ID
/job/US-Oregon-Hillsboro/Yield-Development-Engineering-Manager-Strategic-Programs_JR0285290
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