Thermal Engineering Intern

About This Role

• This position requires candidates to upload a resume in English; you are welcome to upload multiple versions of your resume if you prefer but an English version of your resume will be required to be considered for this position.
• We are seeking a dynamic individual to join the DCG's Cloud and AI System HW team (CASH) team as a Thermal Intern.
• This individual will be part of a larger a cross functional Architecture/Engineering team (i.e.
• Board/ System, Mechanical, Thermal, SI/PI/PD, etc.) responsible for Co-Engineering Custom Design Systems with strategic customers.
• Additionally, this person will be a contributor in CASH's Thermal/Mechanical Center of Excellence (CoE) - defining/driving/bringing to market new platform level innovations and solutions that: Proactively addresses Thermal/Mechanical issues our CSPs face.
• Integrate Intel's Adjacent Technologies/Solutions (i.e., Networking, MCR, AI/Machine Learning, etc.).
• Drive new thermal innovations that push next level performance within the CSP's environment.
• Responsibilities will include but not be limited to: Support thermal engineers with lab testing, data collection, and documentation.
• Assist with thermal modeling setup and review of simulation results.
• Help analyze airflow and temperature data.
• Document assumptions, results, and identified risks.
• Soft Skills: Self-learner with the ability to independently acquire new technical skills and concepts.
• Curiosity and willingness to learn.
• Follow technical instructions and ask clarifying questions.
• Comfortable working in a cross-functional engineering environment Intern must be willing to work at least 30 hours per week.