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About This Role
- The Role and Impact: Join Intel as a Packaging Module Development Engineer for Thermal Compression Bonding module in Advanced Packaging Technology Manufacturing - Technology Development (APTM-TD) department, where you'll play a pivotal role in shaping the future of assembly and packaging technologies.
- In this position, you will drive innovation and optimization in Thermal Compression Bonding process for Intel's advanced packaging roadmap, contributing directly to the quality, reliability, and manufacturability of cutting-edge semiconductor packages.
- With an emphasis on experimentation, data analysis, and collaboration, you'll support Intel's mission to deliver world-class products that empower global innovation.
- This role provides an opportunity to make a meaningful impact on Intel's success and growth in the semiconductor industry.
- Key Responsibilities: Develop and optimize assembly processes and equipment to enable Intel's next-generation packaging technologies.
- Apply statistical methods and principles of design of experiments (DOE) to establish and improve process specifications.
- Analyze process data to identify opportunities for improving quality, yield, productivity, and cost efficiency.
- Collaborate with cross-functional teams to ensure manufacturability and reliability of package designs.
- Document technical advancements and improvements through white papers and reports.
Requirements
- Possess a Master's degree in Mechanical Engineering, Materials Engineering, Electrical Engineering, Electronic Engineering, Chemical Engineering, Physics, or a related STEM field.
- Familiarity with semiconductor assembly equipment and processes.
Nice to Have
- PhD degree holders, or Master’s degree holders with less than 2 years of experience in Thermal Compression Bonding process, with First Class Honours required.
- Experience with data science tools such as Python, SQL, or JMP.
- Proficiency in statistical methods, including statistical process control (SPC) and data analytics.
- Fundamental understanding of semiconductor devices and packaging technology.
- Mechanical design experience, including CAD tools.
- Strong written and verbal communication skills, with the ability to influence and collaborate across teams.
- A proactive approach to challenges and the ability to thrive under tight timelines and schedules.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Open roles at Intel
672 positions
Job ID
/job/Malaysia-Kulim/Thermal-Compression-Bonding-Development-Engineer_JR0286064
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