Substrate Supplier Enablement Engineer

About This Role

• The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers.
• As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
• In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand.
• This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.
• Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.
• Responsibilities Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies.
• Partner closely with on site supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions.
• Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency.
• Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement.
• Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines.
• Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity.