Advanced Packaging Internship Program

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About This Role

  • As a Module Engineering Undergraduate Intern, you will gain hands-on experience and work closely with engineers to support manufacturing operations also contribute to projects that improve equipment performance, process control, and production efficiency.
  • Your contributions will directly impact production goals and drive improvements in manufacturing methodologies, offering a unique opportunity to expand your technical expertise while exploring future career prospects in a collaborative environment.
  • Key Responsibilities Support equipment troubleshooting, maintenance, qualification, and improvement activities.
  • Assist in process optimization and continuous improvement projects.
  • Collect, analyse, and interpret manufacturing data to support engineering decisions.
  • Conduct technical research, literature reviews, and assessments.
  • Support Design of Experiments (DOE), data analysis, and validation activities.
  • Assist in laboratory experiments and process evaluations.
  • Prepare technical reports, presentations, and documentation.
  • Collaborate with cross-functional teams to achieve manufacturing and engineering objectives.

Nice to Have

  • Currently pursuing a Bachelor's Degree in Electrical & Electronic Engineering, or related engineering disciplines.
  • Good interpersonal, written, and verbal communication skills in English.
  • Strong analytical and problem-solving skills.
  • Able to work independently and in a team environment.
  • Basic knowledge of semiconductor manufacturing, process engineering, or equipment engineering.
  • Proficient in Microsoft Office applications (Excel, PowerPoint, and Word); familiarity with programming, database management (e.g., SQL), data analytics tools, or engineering software is an added advantage.
  • Eager to learn and adapt in a fast-paced manufacturing environment.
  • Able to commit to a minimum internship period of 3 to 6 months , subject to university/college internship requirements and academic calendar.

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Intel

Malaysia, Kulim

Specialisation
Open roles at Intel
594 positions
Job ID
/job/Malaysia-Kulim/Advanced-Packaging-Internship-Program_JR0286607

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