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About This Role
- The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers.
- As a member of the Substrate Technology Integration Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers.
- In this position, you will lead substrate supplier development and qualification activities, ensuring suppliers achieve the required readiness to support growing customer demand.
- This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners.
- Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives.
- Responsibilities • Collaborate with suppliers and internal engineering teams to develop robust building block processes across component embedding, core fabrication, laser drilling, dielectric lamination, lithography, electrolytic multi metal plating, defect inspection/metrology, electrical testing, and other substrate technologies. • Partner closely with on site supplier engineering teams and the APTD Substrate Integration team to advance substrate building block technologies and manage critical process interactions. • Ensure suppliers meet all Product Control System (PCS) commitments with rigor and consistency. • Work with cross functional teams to design and implement new factory technology validation and product certification plans focused on yield improvement. • Develop and maintain detailed micro schedules for new factory startup activities, including key milestones, to ensure supplier alignment with startup timelines. • Lead qualification activities and monitor ramp indicators to enable an incident free production ramp and successful introduction of new capacity.
- Behavioral traits: - Proactive and adaptable approach to challenges, with the ability to excel under pressure. - Strong collaboration, communication, and leadership skills to drive cross-functional initiatives. - Enthusiasm for learning and contributing to Intel's mission of technology leadership.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
- Minimum Qualifications - Bachelor's degree with 6+ years of experience, OR Master's degree with 4+ years of experience, OR PhD with 2+ years of experience in Mechanical Engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, or a related technical field.
- Experience listed above should be in the following: - Statistical tools and methods, including Statistical Process Control (SPC) for yield improvement. . - Experience managing complex projects and deliver results in high-volume manufacturing environments.
- Preferred Qualifications - A strong foundation in advanced packaging, substrates, or semiconductor manufacturing; proven leadership in supplier management or technology enablement; and the ability to drive alignment and execution across global teams. - Proven ability to thrive in high-ambiguity environments and deliver results under pressure.
- Knowledge of advanced packaging technologies and substrate/assembly manufacturing methodologies. - Familiarity with characterization techniques such as X-ray, SEM, FTIR, and EDX. - Experience with process flow development, FMEA, DOE design, and problem-solving tools.
- Make your mark by applying today and be part of shaping the future of innovation at Intel.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $120,860.00-231,670.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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Specialisation
Open roles at Intel
712 positions
Job ID
/job/US-Arizona-Phoenix/Substrate-Supplier-Enablement-Engineer_JR0281431
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