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About This Role
- The Role and Impact Join Intel's Packaging Module Development team and play a critical role in shaping the future of assembly packaging technologies.
- As a Packaging Module Development Engineer, you will design and optimize innovative processes and equipment to support Intel's roadmap for next-generation packaging solutions.
- Your work will directly impact manufacturing efficiency, product reliability, and technological advancements, ensuring Intel maintains its position as a global leader in the semiconductor industry.
- Business group Intel's Packaging Module Development team focuses on advancing assembly and packaging technologies that enable cutting-edge solutions across Intel's diverse product portfolio.
- This group collaborates with cross-functional teams to drive innovation in manufacturing processes, enhance product reliability, and support Intel's broader mission of delivering world-class technologies.
- Key Responsibilities of ATD Media Inspection Handling Laser Equipment Development Engineer - Develop and refine packaging processes and equipment to achieve quality, reliability, cost, yield, productivity, and manufacturability targets. - Apply Design of Experiments (DOE) principles and statistical methodologies to optimize processes and specifications, documenting findings through technical reports. - Design and maintain equipment to evaluate packaging technologies under simulated field conditions, such as heat, humidity, temperature cycles, and dynamic forces. - Ensure manufacturability of physical layouts in package design and oversee the lifecycle of manufacturing workflows. - Define material specifications and collaborate with supplier quality and procurement teams to ensure compliance with quality and performance benchmarks. - Innovate new techniques, tools, and quality screens to proactively identify and mitigate packaging reliability challenges. - Set reliability benchmarks based on a thorough understanding of failure mechanisms to meet customer needs. - Lead problem-solving initiatives and drive continuous improvement in equipment and processes. - Provide expert consultation to internal teams and partners on packaging challenges and technical solutions. - Standardize product qualification practices and manufacturing quality systems while managing technical risks aligned with product milestones.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
- This position is not eligible for Intel immigration sponsorship.
- Minimum Qualifications Bachelor's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 3+ years of relevant experience. -OR- Master's degree in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 2+ years of relevant experience. -OR- PhD in Mechanical Engineering, Materials Science, Metallurgical Engineering, or a related STEM field with 6+ month of relevant experience.
- Relevant experience should include any of following: - Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE) principles. - Familiarity with mechanical drawings and Geometric Dimensioning and Tolerancing - Competency in mechanical design software such as SolidWorks or AutoCAD.
- Preferred Qualifications - Proven ability to lead technical innovation and manage complex, time-sensitive projects. - Understanding of semiconductor fabrication processes and packaging technologies. - Familiarity with supply chain management in a manufacturing or materials qualification environment. - Experience with high-precision manufacturing methods, including stamping and CNC machining.
- Join Intel's team of innovators and contribute to defining the future of technology.
- Apply now to make your mark and help shape industry-leading packaging solutions.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $115,110.00-188,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
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Specialisation
Open roles at Intel
594 positions
Job ID
/job/US-Arizona-Phoenix/ATD-MIHL-Equipment-Development-Engineer_JR0285730
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