Sr. Engineering Manager, Advanced Packaging Technology and Manufacturing Product Engineering
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About This Role
- Advanced Packaging Technology and Manufacturing (APTM) Yield and Product Engineering is looking for an engineering leader to establish, develop and scale the end-to-end product engineering (PE) team that optimizes advanced packaging products for design, testability, yield and quality for predictable execution and continuous cost and quality improvements.
- The PE group leader is responsible for managing the engineering teams leading APTM efforts on product optimization for DFx, yield, quality and manufacturability spanning execution from definition, technology development through high volume manufacturing.
- This role is accountable for driving optimized solutions across a broad spectrum of advanced packaging technologies while meeting the highest quality standards for internal and external customers.
- In this pivotal role, you will shape the priorities for a high-performing product engineering team, ensuring the delivery of high-quality outcomes that meet Intel's standards for innovation, cost optimization, and operational excellence.
- Key Responsibilities: Establish organizational structure, execution strategy and roadmap to ensure all development and manufacturing requirements across product portfolio are comprehended Establish/update critical product (and/or test vehicle) readiness indicators for critical performance metrics around DFx, test coverage, test time, yield and product quality to ensure progress along technology phase gates and product milestones Influence test vehicle/test chip designs to improve detection, testability and design resiliency across a broad envelope of product use cases during early PADK definitions and product designs during pre-silicon definition in partnership with customers for high yields and quality Establish and implement standardized guidelines, methodologies and governance for integrated test content definition for test vehicles/test chips and health monitors for product where applicable with internal and external customers Partner with internal design, test integration, NPI and manufacturing groups within APTM and with product groups to map dependencies and ensure alignment on development deliverables and product execution in line with customer expectations Develop/harden business process for pre-Si planning and NPI execution and debug in partnership with test, NPI and manufacturing partners Provide technical leadership on device, defect and process yield interactions and debug support for customers during product development through rigorous data analysis and root cause identification to minimize impact to supply, quality and schedule commitments.
- Establish streamlined end-to-end connected systems and analytics for integrated view on product health in the backend flow for proactive monitoring of leading indicators for predictable execution Ensure core functions are adequately resourced for agility, focus, and execution efficiency to deliver outcomes on organization and product priorities.
- Ensure that the organization meets planned budget/cost targets while driving continuous improvement activities to improve manufacturing and product competitiveness Communicate project status and risks effectively with leadership and executive communication forums Lead organization and leadership development to grow technical capability and business acumen to enable the capability to deliver to product commitments Required Skills and Experience: Expertise in product development processes related to integrated circuits, including testability and manufacturability.
- Proficiency in manufacturing and quality systems, tools, and methodologies.
- Strong analytical skills, with experience in data analysis, debug, and root-cause identification.
- Proven ability to manage cross-functional teams and deliver complex projects on schedule.
- Preferred Skills and Experience: Demonstrated leadership in managing diverse teams and driving organizational success.
- Experience with Intel or external product development, DFx, Test content development and backend test methodologies Proven experience leading high-performing engineering team, role model Intel values, foster a culture of safety, execution excellence, continuous improvement and accountability.
- Exceptional communication skills to articulate technical concepts and project risks to executive leadership.
- Experience in continuous improvement methodologies and operational excellence.
- A strategic mindset with the ability to inspire and develop talent, ensuring team collaboration and performance.
- Note: This role requires regular onsite presence when managing employees whose responsibilities necessitate onsite work.
- Managers of onsite essential roles are expected to be onsite to support operational needs.
Qualifications
- Bachelor's or Master's degree and/or equivalent prolonged course of study in Electrical engineering or related field .
- Advanced degree preferred. 12+ years of relevant experience with a Bachelor's degree, 8+ years with a Master's degree, or 6+ years with a PhD.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $256,050.00-361,480.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
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712 positions
Job ID
/job/US-Arizona-Phoenix/Sr-Engineering-Manager--Advanced-Packaging-Technology-and-Manufacturing-Product-Engineering_JR0282663
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