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About This Role
- About This Opportunity Join Intel's Wireless Communications Solutions (WCS) team during an exciting period of innovation and new development opportunities.
- WCS focuses on developing advanced wireless technologies and solutions that enable seamless connectivity across a wide range of devices and platforms.
- The group specializes in wireless communication products including Wi-Fi, Bluetooth, and emerging wireless standards, delivering high-performance, reliable, and secure wireless solutions.
- WCS drives innovation in wireless connectivity by integrating cutting-edge hardware and software technologies to meet the evolving needs of consumers and enterprise customers.
- The business unit ensures regulatory compliance and quality through rigorous product regulatory life cycle management aligned with Intel's global standards and country-specific requirements.
- WCS is committed to advancing wireless communication capabilities, supporting Intel’s leadership in the wireless ecosystem, and enabling next-generation connected experiences.
- As a Silicon Packaging Architect/Engineer, you'll drive cutting-edge semiconductor packaging technology and architecture for WiFi, Bluetooth, and mmWave products, focusing on RF/Electrical, Thermal, Mechanical, Reliability, and Cost optimization.
- What You'll Do Strategic Leadership & Architecture: Translate product requirements into comprehensive package architecture specifications.
- Lead technology trade-off decisions ensuring packages meet electrical, mechanical, thermal, and reliability standards.
- Lead Package level simulations (Mechanical and Thermal) to address specific risk areas.
- Define overall product package performance specifications and drive technology certification.
- Oversee end-to-end package development processes, from design through production.
- Technical Excellence & Innovation: Troubleshoot complex packaging problems and develop innovative, cost-effective solutions Research packaging assembly materials and properties, establishing specifications for suppliers Perform mechanical and reliability simulations to optimize package design Conduct thermal performance simulations using predictive FEA analysis Cross-Functional Collaboration: Partner with silicon, hardware, and package design teams to ensure high-quality deliverables Coordinate with internal/external manufacturing partners (OSATs) and substrate suppliers Support product co-design and layout teams as manufacturing liaison Collaborate with Quality & Reliability teams to ensure products meet specifications Complete DFMEA assessments with assembly suppliers to evaluate technology risks Manufacturing & Process Management: Ensure seamless transition from design to high-volume production Design and validate Test Vehicles for process characterization Provide consultation on packaging improvements and process optimization Qualifications: What We're Looking For Education & Experience Minimum Requirements: Bachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science/Engineering, Physics, or related field + 4+ years industry experience.
- OR Master's degree in relevant field + 3+ years experience.
- OR PhD in relevant field + 1+ years experience.
- Required Technical Skills 2+ years package assembly technology development experience. 2+ years packaging FEA simulations (mechanical and thermal). 2+ years package assembly manufacturing processes and HVM ramp experience.
- Preferred Qualifications Experience working directly with external suppliers (OSATs, Tools, Materials, etc).
- Semiconductor device physics and process engineering experience.
- RF Component Packaging experience (highly valued for wireless products).
- Testing systems experience with hardware/software (Matlab, LabView).
- Essential Skills Strong project management capabilities.
- Proficiency in Microsoft Office Suite.
- Excellent communication and presentation abilities.
- Self-driven with strong problem-solving tenacity.
- Action-oriented mindset Why This Role Matters You'll be at the forefront of wireless technology innovation, directly impacting next-generation WiFi, Bluetooth, and mmWave solutions that connect the world.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
712 positions
Job ID
/job/US-Oregon-Hillsboro/Silicon-Packaging-Engineer---Wireless-Communications-Solutions_JR0282295
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