Silicon Packaging Design Engineer

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About This Role

  • The Role and Impact: Intel is seeking a motivated and innovative Layout Design Engineer to join our team of world-class semiconductor professionals.
  • In this role, you will be at the forefront of designing the physical layout of of Intel's silicon that are used for its packaging technology.
  • You will collaborate with customers, electrical engineers (for signal integrity and power delivery) to optimize performance, reliability, and manufacturability, driving innovation and efficiency across our cutting-edge products.
  • As a Layout Design Engineer, you will play a critical role in ensuring Intel's continued leadership in the semiconductor industry, contributing to advanced methodologies and groundbreaking solutions.
  • Key Responsibilities: Develop custom layouts for Intel's silicon used for its packaging technology.
  • Perform detailed physical array planning, area optimization, and signal and power routings.
  • Design and verify standard cell libraries, ensuring compliance with design rules, PDK specifications, and reliability requirements.
  • Execute layout verification processes, including checks for electron migration, voltage drop (IR), self-heat, ESD, and other reliability metrics.
  • Use custom auto-routers and placers to efficiently construct layouts and optimize designs.
  • Troubleshoot design, tool, and methodology issues related to layout construction.
  • Provide feedback to circuit design engineers on feasibility studies and implement circuit enhancement requests.
  • Develop and drive innovative layout methodologies to improve productivity, quality, and manufacturability.
  • Utilize EDA tools and design flows for floor planning, routing, reliability verification, and performance optimization.
  • Collaborate with cross-functional teams to ensure seamless execution of silicon tape-in.

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field. 4+ years of experience in layout design with a Bachelor's degree; 3+ years with a Master's degree; or 0 years with a PhD.
  • Proficiency in using Cadence Virtuoso Layout Suite and other industry-standard EDA tools.
  • Strong understanding of analog device and metal layout fundamentals, design for manufacturing (DFM), and reliability verification processes.
  • Experience in layout construction, debugging, and full-chip top metal/analog routing design.
  • Familiarity with tape-in assembly, route methodologies, and performance verification for layout.

Nice to Have

  • Demonstrated ability to solve complex technical problems and troubleshoot tool and methodology issues.
  • Knowledge of floor planning tools and flows, library integration, and design archiving processes.
  • Effective communication skills to collaborate with cross-functional teams and provide feedback to circuit design engineers.
  • Ability to execute disciplined design processes and align work to Intel's core values and performance standards.
  • We invite you to bring your expertise and creativity to Intel, where you can contribute to industry-shaping innovation while growing your career in a supportive, inclusive, and dynamic environment.

Sourced directly from Intel’s career page

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Intel

Malaysia, Penang

Specialisation
Open roles at Intel
712 positions
Job ID
/job/Malaysia-Penang/Silicon-Packaging-Design-Engineer_JR0283001

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