Silicon Packaging Design Engineer

About This Role

• As an integral part of Intel's new Integrated Device Manufacturer 2.0 (IDM2.0) strategy, we are establishing Foundry Services (FS), a fully vertical, stand-alone foundry business, reporting directly to the CEO.
• Foundry Services will be a world-class foundry business and major provider of US and European based capacity to serve customers globally.
• Foundry Services will be differentiated from other foundries with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe, and a world-class IP portfolio that customers can choose from, including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP's, along with Arm and RISC-V ecosystem IPs.
• Foundry Services will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages.
• Silicon packaging engineering responsibilities include: Drives end-to-end development for mask and panel design from concept through tape out for a given package to produce within the substrate factory.
• Implements physical layout and routing of the panel design and may help with routing the package.
• Performs panel substrate fit studies to establish design, performance, and cost tradeoffs.
• Conducts internal and external reviews, analyzes data, and resolves DRCs to optimize panel design.
• Completes documentation and collateral into the product lifecycle management system of record.