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About This Role
- We are seeking an experienced Silicon Packaging Design Engineer with a strong background in board design and package-board integration to drive the end-to-end development of test boards supporting advanced silicon package validation and characterization.
- The successful candidate will be responsible for board design execution from concept through tapeout, ensuring high-quality, manufacturable designs that meet electrical, mechanical, performance, and cost objectives.
- This role requires close collaboration with package design, test vehicle design, validation, and laboratory teams to optimize board requirements, package-board performance, and system-level integration.
- The ideal candidate will bring deep technical expertise in PCB design, signal integrity considerations, manufacturing requirements, and design rule compliance, along with a proven track record of delivering complex designs in high-volume semiconductor environments.
- Key Responsibilities Drive end-to-end development of test board designs from concept through tapeout.
- Perform board planning, floor planning, routing studies, and physical layout implementation.
- Conduct board fit and routing studies to evaluate design, performance, manufacturability, and cost tradeoffs.
- Partner closely with package design, test engineering, and validation teams to define board requirements and optimize package-board interactions.
- Develop and validate board connectivity, ensuring design integrity and compliance with project specifications.
- Perform design rule checks (DRCs) and manufacturing design rule validation to ensure successful fabrication and assembly.
- Lead internal and external design reviews and drive resolution of design issues and DRC violations.
- Collaborate with board fabrication and assembly vendors to obtain design approval and support manufacturing readiness.
- Define and maintain board design guidelines, standards, and best practices.
- Analyze design data and technical results to identify opportunities for optimization and continuous improvement.
- Create and maintain design documentation and release collateral within Product Lifecycle Management (PLM) systems.
- Support root cause analysis and troubleshooting activities related to board design, package-board integration, and test hardware performance.
- What You'll Bring Strong technical leadership and ownership mindset.
- Complex projects independently while collaborating across global teams.
- Excellent analytical and troubleshooting skills.
- Customer-focused and results-driven approach.
- Passion for innovation and continuous improvement in silicon packaging and board design.
Requirements
- are required to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- This position is not eligible for Intel immigration sponsorship Minimum Qualifications Master's degree in Electrical Engineering or Mechanical Engineering. +10 years of experience with PCB layout utilizing Cadence Allegro and Cadence Constraint Manager. +5 years of experience in: Hardware development including: Schematic Entry, Signal Integrity, and Power Delivery practices and theories, constraint entry, library creation, DFM, DFX.
- Managing highly complex PCB designs both individually as well as part of a team while working across multiple sites.
- Expertise in board design and development, interconnect methodologies, and manufacturability principles.
- Expertise in various board technologies and manufacturing process and fundamentals.
- Demonstrated experience and proficiency with board design rules and design rule check resolution.
- Preferred Qualifications Experience with additional PCB design tools such as Siemens Xpedition.
- Minimum of 8 years of experience with a broad range of PCB form factors, HDI/Type4 PCB technology.
- Previous experience with communicating with board manufacturing vendors to review and obtain design approval meeting vendors manufacturing capabilities.
- Experience interacting with board vendors regarding their capability and design rules roadmap and align internal design teams on design rules roadmap.
- Previous experience managing external CAD contract workers to meet project demands.
- Manage multiple projects, schedules, and multi-disciplined teams in a dynamic, fast-paced environment working across organization boundaries and geographies.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $164,470.00-232,190.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Tools & Skills
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
650 positions
Job ID
/job/US-Arizona-Phoenix/Silicon-Packaging-Design-Engineer_JR0286060
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