Silicon Packaging Design Engineer

About This Role

• As a Silicon Packaging Design Engineer, you will play a crucial role in driving the end-to-end development of innovative substrate designs.
• Your expertise will directly impact the performance, cost, and manufacturability of our products, helping Intel maintain its leadership in the semiconductor industry.
• Working collaboratively with cross-functional teams, you will have the opportunity to optimize silicon-package-board interfaces and contribute to groundbreaking advancements in technology.
• Key Responsibilities include but not be limited to: Drive the entire substrate design process, from design through tapeout, with a focus on performance, manufacturability, and cost optimization.
• Implement the physical layout and routing of package designs using design tools and methodologies and meeting the design requirements.
• Conduct substrate fit and routing studies to evaluate design, performance, and cost tradeoffs.
• Documenting the detailed design requirements clearly in the Package Design Requirement Document.
• Collaborate closely with silicon and hardware teams to optimize silicon-package-board performance and pinout.
• Understand and apply substrate design rules to ensure design quality and compliance.
• Conduct internal and external design reviews and resolve design rule checks (DRCs) to achieve optimal package design.
• Continuously improve in the package design work either by coming up with innovations or driving efficiencies that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.