Signal Integrity Intern

About This Role

• This position requires candidates to upload a resume in English; you are welcome to upload multiple versions of your resume if you prefer but an English version of your resume will be required to be considered for this position.
• We are seeking a motivated and detail ‑ oriented Signal Integrity Intern to support the design, development, and validation of platform hardware and board ‑ level solutions.
• In this role, you will assist with board development activities, including component evaluation, PCB layout reviews, and electrical analysis, while collaborating closely with cross ‑ functional teams.
• This internship provides hands ‑ on exposure to real-world hardware engineering challenges and an opportunity to apply academic knowledge to projects that support Intel’s business objectives in a highly collaborative environment.
• Key Responsibilities Support the design and development of platform hardware and printed circuit boards (PCBs), including evaluation of board components.
• Assist with PCB layout activities, ensuring signal integrity, power integrity, and compliance with electrical design guidelines.
• Participate in board bring-up and debug activities, including lab measurements, issue identification, and resolution support.
• Collaborate with cross-functional teams (signal integrity, power integrity, mechanical, thermal, manufacturing, and validation) to meet system-level requirements.
• Apply signal integrity and hardware design principles to help optimize performance, reliability, manufacturability, and cost.
• Support documentation of design decisions, test results, and debug findings.
• Learn and apply engineering best practices while contributing to projects that align with Intel’s hardware development roadmap and business goals.
• What You Will Learn Fundamentals of signal integrity and board-level hardware design.
• Exposure to high-speed interfaces, PCB materials, stack-ups, and layout constraints.
• Hands-on experience with board bring-up, lab equipment, and debug methodologies.
• How electrical, thermal, and mechanical requirements are balanced in platform design.
• Collaboration within a cross-disciplinary engineering environment.
• Insight into Intel’s end-to-end hardware development lifecycle and career paths in hardware engineering.