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About This Role
- The Role and Impact As a Product Packaging Engineer , you will play a pivotal role in shaping Intel's advanced packaging solutions that directly impact the delivery, performance, and sustainability of cutting-edge products.
- By applying scientific and engineering principles, you will design and develop innovative packaging solutions that ensure the secure transportation and optimal performance of Intel's products globally.
- Joining Intel means contributing to groundbreaking projects, collaborating with industry-leading teams, and driving advancements that align with Intel's mission to deliver world-class technology solutions.
- This role will empower you to influence manufacturing processes, enhance efficiency, and support Intel's growth in the competitive semiconductor industry.
- Key Responsibilities will include but are not limited to: Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.
- Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.
- Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure packaging solutions meet operational needs.
- Identify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
- Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.
- Consult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.
- Evaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.
- Benchmark packaging designs and processes against industry standards to maintain a competitive edge.
- Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.
- Behavioral traits that we are looking for: Demonstrated problem-solving skills in packaging development or manufacturing.
- Effective communication skills to collaborate with cross-organizational teams and external vendors and customers Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
- See Intel Benefits for more details.
Requirements
- to be initially considered for this position.
- Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Note: For information on Intel’s immigration sponsorship guidelines, please see Intel U.S.
- Immigration Sponsorship Information Minimum Qualifications and Experience : Possess a Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 1+ years of educational or work experience.
- Or a PhD degree in the same fields with 6+ months of educational or work experience.
- Your experience described above must be in the following: Product packaging assembly processes and production methodologies.
- Statistical process control (SPC) principles and design of experiments (DOE) techniques.
- Analytical skills with proficiency in data analysis and risk assessment methods.
- Design for manufacturing (DFM) practices and packaging test criteria.
- Preferred Qualifications and Experience : Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.
- Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.
- Familiarity with semiconductor device fabrication processes and packaging process flows.
- A track record of delivering results in time-critical technical projects involving innovation and strategic planning.
- Apply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.
- We are looking for individuals who are passionate about engineering excellence and sustainability.
- Apply today to help drive Intel's global impact through innovative packaging solutions.
Benefits
- We offer a total compensation package that ranks among the best in the industry.
- It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
- Find out more about the benefits of working at Intel .
- Annual Salary Range for jobs which could be performed in the US: $141,910.00-200,340.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations.
- Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training.
- Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Sourced directly from Intel’s career page
Your application goes straight to Intel.
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Specialisation
Open roles at Intel
712 positions
Job ID
/job/US-Arizona-Phoenix/Product-Packaging-Engineer_JR0282767
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